Used CANON ES3 #9272653 for sale

CANON ES3 is a high-precision semiconductor lithography equipment that utilizes a wafer stepper to create advanced semiconductor devices. It is designed to have the ability to handle a wide range of process requirements and can produce devices between 45nm and 180nm. Its stepper technology is a high throughput system that provides maximum efficiency and superior reproducibility. CANON ES 3 features an alignment and exposure module, a wafer stage, a wafer transfer mechanism, and a wafer chucking unit. The alignment and exposure module is responsible for analyzing and directing the light beam to the desired position on the wafer. The wafer stage allows for precise stepping and positioning of the wafers for precise alignment before exposure. The wafer transfer mechanism ensures accurate movement of the wafer between the wafer stage and the exposed area. The wafer chucking machine ensures secure and accurate positioning of the wafer during each step of the lithography process. ES3 utilizes illumination optimization to improve exposure accuracy. Its exposure tool is composed of an advanced lithography illumination asset, a laser alignment model, and a precise custom lens. The illumination equipment is controlled by a high-powered laser that accurately aligns the beam for exposure. The laser uses the on-board, precisely-controlled optics to ensure exposure accuracy and uniformity. The custom lens consists of two large independent lenses and two smaller auxiliary lenses that are carefully aligned to provide uniform exposure across the wafer. ES 3 also features a powerful metrology system which is capable of measuring critical chip parameters such as dynamic range, depth of focus, line width, and critical dimension. This ensures precise measurements at fast checkout speeds, providing customers with detailed and accurate exposure and lithography results. CANON ES3 wafer stepper is a powerful unit that provides accurate, reliable, and high-performance lithography results. Its features make it suitable for applications ranging from simple die to complex high-end chip designs. Its high throughput and precise optical components ensure the highest-level of accuracy and performance.