Used CANON FPA 2000 i1 #9134789 for sale
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ID: 9134789
Wafer Size: 6"
Stepper, 6"
Wafer type: semi flat
Wafer chuck type: LC ring chuck
Track interface: DNS
Auto-feeder (in-line direction): Left, Type 2
Altitude: X m
Signal tower: yes
CE mark (Europe): yes
Edge beam removal: no
Reticle changer:
Reticle size: 5", type 2 with 14 slots
Reticle bar code reader: yes
Library slot number: 14
Workstation:
Workstation model: HP1000
Software:
Main software version: V5.25B
Gem software version: SECS
Facility requirements:
Main electrical supply: 3 Phase, 415 VAC
Exhaust
1x Heat exhaust for chamber
2x Control rack
(Setting 0.5 inc to 2 inc H2O)
CDA Supply: 3X 100psi
Cooling water supply: cooling Water in (pressure=1to5 kg/cm2)
Vacuum: 3X vacuum setting ≤ 550 mm Hg
Drain: 1X drain for chamber aircodition system
Chamber:
Chamber type: TBW-CD-50W
Wafer feeding unit:
Type of wafer feeding unit: Type II
Wafer size: 6"
Carriers: double carriers
Flat/notch finder: flat
Method: non-edge contact, back side holding
XY stage: 6" sliding stage
Tilt stage: yes
Reticle changer system: Type II with 14 slots
Size: 5" Reticle
Reticle alignment system: TV image processing with FRA2 mark
Alignment source: g-line
HeCd laser: No
Auto wafer alignment system:
Auto alignment source: HeNe Laser (1 for X, 1 for Y)
Method: through the len off axis auto alignment
Mode: die and die and AGA
Projection lens:
Magnification: X 1/5
Numerical aperture: 0.55
Illumintor:
Light source: 1 KW Hg Lamp
Exposure time control: light integrator
Masking function: variable with 4 independent masking blades
Auto focus:
Method: optical auto focus
Other: auto compensation for barometric pressure change
Mechanical prealignment: non-edge contact
TV prealigment: TV image processing
Monitor display: LCD.
CANON FPA 2000 i1 is a wafer stepper, a type of photolithography instrument used to produce specific patterns on the edges of semiconductor wafers. It is capable of producing wafer patterns with high precision and accuracy in a wide range of sizes. CANON FPA2000-I1 has a large, 3 to 5 µm field size and can perform automatic pattern generator alignment and wafer alignment in an efficient, high-speed operation. The photolithography used in FPA-2000I1 is based on flex track technology, a unique CANON feature that has a variable flexure stiffness and can be fine-tuned for each application. This enables it to deliver high-precision exposure control as well as fast, accurate alignment and stitching for the most demanding semiconductor patterns. CANON FPA 2000 I 1 is also equipped with a multi-exposure feature, allowing it to achieve improved pattern uniformity. CANON FPA-2000I1 has an automated exposure equipment, including lighting, optical metrology, edge detection, and a fully automated, closed-loop, exposure process. It is designed to operate continuously without any manual intervention and can achieve critical pattern control with a single exposure. The system is equipped with an air curtain and sophisticated air control that reduces contamination, which is essential for achieving clean, high-resolution patterns. FPA 2000 i1 also delivers versatile patterning capabilities. The unit can expose binary resolution patterns and dense lines with high accuracy, and it can also be used to form circular or serpentine patterns. The instrument also has the ability to integrate multiple patterns on a single wafer over time. FPA-2000 I 1 includes multiple built-in safety features. Its motorized stage is enclosed and temperature-controlled to maintain a stable environment, while its robot-controlled stages control displacement and orientation to ensure accurate exposure. An emergency stop button allows unauthorized access attempts to be blocked. In summary, CANON FPA-2000 I1 is a high-precision wafer stepper with advanced features that provide superb performance and reliability. Its flex track technology and multiple-exposure machine make it an ideal tool for any wafer patterning application, and its built-in safety measures ensure secure operation.
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