Used CANON FPA 2500 i3 #293819904 for sale
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ID: 293819904
Wafer Size: 8"
Vintage: 1996
Stepper, 8"
Exposure Performance:
Normal illumination: 0.40 µm or better
SIA illumination: 0.35 µm or better
SIB illumination: 0.40 µm or better
PFI‑26, 1.025 µmt
CD Depth of focus:
Normal illumination: ≥ 1.0 µm (range)
SIA illumination: ≥ 1.2 µm (range)
SIB illumination: ≥ 1.4 µm (range)
0.40 µm L&S
Image surface width (Normal illumination): ≤ 50 µm
Distortion:
Normal illumination: within ±0.07 µm
SIA illumination: within ±0.08 µm
SIB illumination: within ±0.08 µm
Illuminator:
Illumination Intensity:
Normal illumination: ≥ 550 mW/cm²
SIA illumination: ≥ 330 mW/cm²
SIB illumination: ≥ 330 mW/cm²
Illumination Uniformity:
Normal illumination: Within ±1.2%
SIA illumination: Within ±1.5%
SIB illumination: Within ±1.5%
Dose Control Accuracy
≤ ±1.2%
Masking Accuracy
≤ ±100 µm
Alignment Accuracy:
Reticle Rotation Accuracy: ≤ ±0.02 µm
Reticle Rotation Repeatability: ≤ ±0.03 µm (range)
Alignment Accuracy:
HeNe TV AGA: ≤ ±0.07 µm (| m | + 3s)
Broad Band TV AGA: ≤ ±0.07 µm ( m | + 3s)
Auto Focus:
Repeatability: ≤ 0.12 µm (3s)
Die By Die Leveling:
Repeatability: ≤ 10 µm (3s)
Compensation Range: ≤ ±100 ppm
XY Stage Accuracy
Stepping Accuracy: ≤ 0.06 µm (3s)
Scaling: ≤ ±1.0 ppm
Orthogonality: ≤ ±1.0 ppm
Prealignment Accuracy:
Mechanical PA Accuracy: ≤ ±40 µm
Throughput:
L‑Type Auto Feeder
With Die‑by‑Die Leveling OFF:
6" (45 shots): 62 wafers/hour or more
8" (78 shots): 44 wafers/hour or more
With Die‑by‑Die Leveling ON:
6" (45 shots): 57 wafers/hour or more
8" (78 shots): 40 wafers/hour or more
R‑Type Auto Feeder
With Die‑by‑Die Leveling OFF
6" (45 shots): 61 wafers/hour or more
8" (78 shots): 44 wafers/hour or more
With Die‑by‑Die Leveling ON:
6" (45 shots): 56 wafers/hour or more
8" (78 shots): 40 wafers/hour or more
Reliability:
Reticle handling: 50 cycles
Wafer handling: 300 cycles
Compact chamber:
Temperature Control:
Booth: 21 °C
Stage: 23 °C
Cleanliness: within ±0.1 °C
1996 vintage.
CANON FPA 2500 i3 is a wafer stepper - a type of wafer fabrication and inspection tool used in the semiconductor industry. It is suitable for qualifying and inspecting a wide range of wafers, ranging from 300mm to 200mm in diameter. The i3 is a dual-field alignment system, with two distinct zones of operation. The dedicated alignment stage enables precise alignment of wafers and substrates, thanks to its high-precision motors with sub-micron accuracy. The wafer is then placed in the focal plane array, a range of optical elements that capture high-resolution images of the wafer's surface and then projects them onto a LCD monitor for easy viewing. CANON FPA-2500I3 includes a variety of features designed to increase efficiency and reliability. It features a high-speed transverse motion system for fast on-the-fly movements of the wafer, as well as a fully-enclosed optics package for temperature control and improved throughput. It also includes a proprietary pattern matching algorithm for detecting and placing defects. The i3 provides advanced wafer mapping capabilities, including physical, electrical, and optical mapping for use in efficient wafer qualification and inspection. It enables high-definition video inspections of particles such as scratches and stains, allowing for more accurate defect detection and rejection of damaged wafers. Finally, the system has a large memory capacity, supporting up to 1TB of internal memory to store images and data for analysis purposes and to generate reports in PDF, PSD, and CSV formats. For users' convenience, FPA-2500 I3 has a user-friendly interface, allowing for quick and easy navigation of complex user controls. Additionally, it features a wide range of scanning parameters including scan speed, image type, and image resolution, as well as a variety of sensors to gather critical data for quality-control purposes. The i3 also supports software updates via the Internet, enabling users to stay current with the latest advancements in wafer inspection technology. Overall, FPA 2500 i3 is a highly efficient and reliable wafer stepper for use in semiconductor manufacturing and inspection process. With its high-precision motors, powerful optics package, and wide range of software and hardware features, the i3 is well-suited for producing and qualifying high-quality wafers in the most efficient manner possible.
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