Used CANON FPA 3000 EX3 #9077395 for sale

CANON FPA 3000 EX3 wafer stepper is a state-of-the-art lithography equipment designed to quickly and accurately produce integrated circuits onto wafers. It utilizes a high-resolution optical imaging system which is coupled with an advanced wafer stage to produce die-level precision. The unit features an advanced dry glass-tube imaging column, a large 12-inch work area and an adjustable step and repeat cycle time. FPA 3000 EX3 has the capability to support a wide range of reticles and wafer sizes up to 180 mm. The stepper utilizes an advanced wafer stage which supports up to 200mm wafers with extremely high accuracy, repeatability and uniformity. The stage includes three linear drives and one rotary drive systems for smooth, precise positioning and scanning. The stage features adjustable acceleration and deceleration profiles which allow high-speed exposure applications. The imaging machine features an advanced auto-collimation technology for precise focusing. This enables CANON FPA 3000 EX3 to produce high-resolution images with extremely low linewidth distortion. The auto-collimation tool also offers variable focus speed and repeatability. The imaging asset is coupled with a high-speed scanning drive which allows a maximum step-and-repeat scan speed up to 200mm/s. The model includes an automatic reticle alignment capability which minimizes the need for manual wafer positioning. The alignment equipment allows multiple exposures at various alignment offsets without repositioning the wafer on the stage. It also has an on-board wafer mapping system which allows overlay measurement and correction. FPA 3000 EX3 boasts a host of smart features and capabilities which make it suitable for semiconductor applications. It offers high throughput, simultaneous multi-pass capability, high product yield, integrated defect inspection and customizable imaging solutions. This unit is an ideal choice for producing advanced semiconductor products such as LEDs, MEMS, RF ICs and many more. It provides superior end-product performance, enhanced engineering capabilities and seamless integration in the manufacturing environment.