Used CANON FPA 3000 i4+ #9256525 for sale

CANON FPA 3000 i4+ is a state-of-the-art high-volume wafer stepper designed to meet the rigorous needs of the advanced semiconductor fabrication industry. It consists of an ultra-precise optical equipment for patterning of photomasks onto wafers, along with a multi-zone automatic alignment system to ensure accuracy and repeatability across production lots. The unit provides up to 175W of illumination power, suitable for sophisticated high-resolution imaging of even the most complex patterns. It has two stages of optical alignment, each consisting of three axes that allow accurate dimensional registrations of the photomask and wafer. Two high-resolution cameras are included with micron-level scanning resolution. The wafer-stepping machine features ultra-precise, highly repeatable metrology systems, which include automated scanning and comparison of the wafer and mask during exposure. FPA 3000 i4+ is capable of sub-100nm resolution imaging, with a best-case resolution of 80nm. It utilizes an advanced multi-zone exposure algorithm to ensure high yield, which is further enhanced through the built-in masking overlay. The included optics tool delivers high accuracy and repeatability with minimized chromatic aberration and aberrations. It incorporates an automated wafer feeding asset for high throughput and superior wafer handling. The stepper also features a new maximum vertical movement model which allows movements up to 20mm, enabling 3D patterning on complex wafer geometries. This advanced stepper also has an advanced heuristics equipment for reducible-scaling, which allows parts-per-million defect levels to be achieved. It has an intuitive user interface, capable of custom-programmed control, as well as a remote access option for troubleshooting and monitoring. CANON FPA 3000 i4+ is designed for scalability and provide upgradability to accommodate changing fabrication techniques and needs. It is compatible with a wide range of substrates and can handle wafers ranging from 200mm to 450mm diameter. It is a highly efficient and reliable solution for demanding wafer processing demands.