Used CANON FPA 3000 iW #9151772 for sale

Manufacturer
CANON
Model
FPA 3000 iW
ID: 9151772
Fine pattern aligner Parts unit.
CANON FPA 3000 iW is a state-of-the-art wafer stepper featuring superior performance and reliability. This wafer stepper is used in the manufacture of semiconductor devices, including lithography processes, and is designed for high precision and accuracy. It is capable of achieving 100nm resolution and has a 0.33NA illumination equipment. CANON FPA 3000IW wafer stepper is an advanced device designed to deliver production-ready lithography processes. This device is capable of performing both single and double exposure processes, as well as step-and-repeat and cluster tools. It features an ultra-short exposure spot diameter of 100nm. This highly compact system is uniquely designed to optimize space utilization. FPA-3000IW also features a stage design that provides three-axis synchronization and fast settling time. This allows for accurate and precise alignment of each die. It also has an optimized stage chiller unit designed to ensure process stability even in changing conditions. A built-in active alignment machine is also included to ensure high-precision alignments of the lithography field. The built-in FPA image projection optics is designed to provide clear image generations over a range of T in diffraction limited lens. It also provides in-position pattern registration. As well, the advanced illumination tool is designed to perform exact equal illumination over the exposure area. CANON FPA-3000 IW has a robust design with a high degree of reliability and uptime. It offers a software-based asset for detection and correction of upsets and other errors. As well, it features a design that allows for flexible integration with different operating systems and high-speed data transfer. In conclusion, FPA 3000 I W wafer stepper is an advanced device designed for the manufacturing of semiconductor devices. It is capable of achieving high precision and accuracy with its 0.33NA illumination model and ultra-short exposure spot diameter of 100nm. It features an optimized stage chiller equipment and active alignment system. As well, this device has a robust design that is highly reliable and offers an efficient unit for performing lithography processes.
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