Used CANON FPA 5000 ES3 #9200130 for sale
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CANON FPA 5000 ES3 is a state-of-the-art semiconductor wafer stepper designed to meet the needs of a wide range of integrated circuit (IC) wafer production requirements. This stepper features a 300mm substrate size, providing high throughput for increased overall wafer output. With scan field sizes up to 18mm x 18mm, CANON FPA 5000ES3 offers high resolution imaging for complex and high density circuit patterns. This is especially beneficial for the production of mixed-logic devices and advanced memory designs. The stepper's advanced optics equipment boasts an optical column magnification range of 5x, 10x and 20x, with 1.35nm minimum linewidths achievable at the longest column configuration. FPA-5000 ES3 has advanced depth-of-focus (DOF) control with ½ micron depth of focus enabled by its sophisticated dual-Monte Carlo algorithms. This stepper is also designed for maximum uptime and productivity. It features a 'no-time-lost' failover system with a 'follow-on' illumination and shadow sensor, which allow another operation to take its place in the event of a malfunction. The stepper incorporates a suite of vision sensors for accurate alignment of wafers and exposure time correction, as well as an additional in-line inspection unit to detect any latent defects during the exposure process. CANON FPA-5000 ES3 is capable of processing multiple wafer types such as silicon-on-insulater (SOI), silicon-on-glass (SOG), or any combination of them. In addition, the stepper has features that protect sensitive wafers, for example, advanced vibration isolation of the exposure head, which prevents vibration-induced failure during exposure. This equipment is designed with easy serviceability and quick maintenance in mind. Direct access to all its components and easily interchangeable parts allow for quick and reliable up to 50 percent maintenance time savings. FPA 5000 ES3 is a most advanced wafer stepper for the most demanding and advanced wafer production requirements. With its advanced optics machine, advanced DOF control, ability to process multiple wafer types and serviceability features, FPA 5000 ES 3 is an excellent choice for IC production facilities.
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