Used CANON FPA 6000 ES6 #9235775 for sale

CANON FPA 6000 ES6 is a wafer stepper designed to support advanced packaging applications. CANON FPA-6000 ES6 offers a wide range of features designed for optimum performance. It features opto-Bedsteerable alignment technology, allowing for subtleties with less uncertainty and traceability. This is enabled by a newly developed advanced galvanometer mirror system which can easily adjust the exposure position down to 0.1 micron, providing greater precision and accuracy even when exposure levels are high. FPA 6000 ES6 comes equipped with advanced Precision Multi-Layer Exposure (PMLE) and a high transmission space. This allows the stepper to retain high resolution, with uniformity within the maximum 3 micron layer-to-layer registration. This also comes with a fast wire-width mapping and homogenous processes for 3D device fabrication, allowing for higher precision and throughput within the same layer. FPA-6000 ES6 is equipped with several advanced automation capabilities. This includes an autofocusing system which allows working with 1X, 5X, and 10X objectives, allowing one to calibrate image, pattern, and wafer position manually or automatically. It also allows for High-Density Plating (HDP) processes, enabling to reduce processing time by up to 40%. In addition, it also supports different wafer sizes, ranging from 8 inches to 12 inches. This exposes production of next generation's wafer technology that may be large enough for sophisticated stacking or other designs. The high-precision CANON FPA 6000 ES6 is also designed to achieve higher performance throughput. This is done by increasing the stage speed to the maximum of 2.8 inch/second without compromising the accuracy and precision. In addition, it has an alignment accuracy of 0.3 microns, reducing non-productivity caused by poor alignment. Its CCD-type alignment gives it the capability to measure over a wide field of 9.6mm while reducing the measuring time. Finally, CANON FPA-6000 ES6 is equipped with interlocking memory control to back up the write data and make sure that the alignment and exposure processes are precisely matched to the chip design. It also has a double tracking system with an alignment error peak detection. This provides a layered and precise latitude to ensure a precise stable wafer movement throughout the entire process.