Used CANON FPA 6000 ES6a #9227778 for sale

CANON FPA 6000 ES6a is a state-of-the-art, high-resolution machine designed to produce top quality photomasks for the production of semiconductor wafers. It is a step and repeat / laser alignment / pattern generator / overlay measurement equipment featuring extreme accuracy and high resolution. The machine is ideal for production of features down to 0.18 µm (7.5 nm). It offers a wide range of features including multiple exposure options, exposure alignment, off-axis alignment, overlay accuracy and cross-field alignment. CANON FPA 6000ES6A offers an impressive range of features, options and innovative technologies making it the premier choice for production of advanced chips and other semiconductor wafers. The machine's main components are a high- resolution laser stepper, an alignment station, a linear positioning system, an integrated laser pattern generator, a large-capacity wafer stage, an adjustable focusing unit and a comprehensive control machine. The optical tool consists of an illumination asset featuring near diffraction-limited optics for improved contrast and resolution, an exposed image alignment model, a built-in laser pattern generator with a unique beam splitter to provide superior overlay, and a demagnification equipment for optimum overlay accuracy when producing features down to 0.18 µm (7.5 nm). A newly developed off-axis alignment system offers the highest degree of accuracy and precision for overlay measurements and cross field alignment. FPA-6000ES6A also features dedicated software, providing control over all of the machine's built-in features and options. It is designed for easy navigation and operation to provide users with excellent productivity and image quality. With its optional auto-pattern generator, users can quickly create and load pattern files into each stage of the stepper's exposure unit. The automated overlay compensation systems enable precise multi-exposure alignment for high-accuracy registration of overlay features. Users can access more advanced capabilities such as defect repair for chips-on-a-wafer and track repair for repetition of patterns on a single chip, which is offered as an option. FPA 6000ES6A is an excellent choice for a variety of applications, such as high-precision industrial production, advanced wafer-level packaging, and optoelectronics. It provides users with a choice of high-resolution imaging and overlay alignment options, making it suitable for increased production yields, accuracy and reliability. This machine is ideal for quality-oriented businesses and those in the semiconductor industry who require maximum performance in the production of precise and high-quality wafers.