Used CANON FPA 6000 ES6a #9251795 for sale

CANON FPA 6000 ES6a is a world-leading wafer stepper for advanced semiconductor processing. This state-of-the-art equipment offers high throughput, repeatable high-resolution imaging, and the flexibility required for cost-effective production of devices from low cost to the most advanced wafers.. CANON FPA 6000ES6A wafer stepper is equipped with a field-emission source and is capable of extremely accurate alignment repeatability across the entire wafer, allowing for step and exposure repeatability at sub-micron precision. The system's high numerical aperture of 0.23 and extremely short focus length of only 6 mm allows for superior image resolution and feature recognition, making this an ideal device for thin-film deposition and sophisticated 3D feature fabrication. With a maximum throughput of 200mm wafers per hour, the unit allows for quicker cycle times and more efficient production runs, resulting in reduced production lead times and lower costs. FPA-6000ES6A wafer stepper allows for advanced wafer processing in addition to typical semiconductor processing. Features such as integrated fast-tool changers, low-vibration imaging, and fast, intuitive software algorithms enable automatic placement and alignment of reticles, design optimization, and tight process control. The master overlay machine integrated with the stepper provides additional flexibility in process optimization, providing the user with enhanced production results. FPA 6000ES6A wafer stepper offers a ray of advanced features and options to further customize production and reduce costs. A Premium Automation Suite provides real-time process monitoring and a Control Unit allows advanced statistical process and product control. The end-to-end wafer handling solution provides an easy transition from wafer to wafer for both batch and single-wafer processes. Overall, CANON FPA-6000ES6A is a powerful and reliable wafer stepper designed for efficient and cost-effective semiconductor production. Its high-resolution imaging and integration of automated algorithms makes it ideal for advanced wafer processing and features, while its fast throughput and customizable options ensures that it can meet the needs of any production environment.