Used GCA 6300B #9260038 for sale

GCA 6300B wafer stepper is a front-end metrology tool used in the production of semiconductor devices. It is an automated device that is used to inspect and measure the characteristics of 2D/3D micro-devices and thin-film structures. It is capable of providing accurate and repeatable measurements of the surface features, such as steps, topography, and aspect ratios, and also supports an array of micro-machining applications. 6300B wafer stepper is equipped with a performance controller, a digital signal processor (DSP), a digital-to-analogue converter (DAC), and an analog-to-digital (ADC) converter. The controller provides high-speed analysis and can be used to control the stepper in real-time. The DSP is used to measure data from the wafers, while the DAC and ADC convert signals for analysis. GCA 6300B wafer stepper also features a high-resolution imaging equipment, consisting of an optical microscope, ahigh-resolution camera, and a laser scanner for 3D imaging. The imaging system has a field-of-view that ranges from 30x to 300x with a minimum feature size is 0.3 μm. The stepper is also capable of measuring ultrathin layers from a few ten nanometers thick to several hundred nanometers thick. 6300B wafer stepper has an internal thermal control unit that allows for temperature stability across the entire process, ensuring the highest levels of product repeatability. The stepper comes with an integrated wafer loader, enabling loading and unloading of wafers up to 150 mm in diameter. It also has an integrated vacuum chuck machine and is equipped with a wafer tracking tool to automatically identify each wafer. GCA 6300B wafer stepper provides support for various process tools and techniques including ion-milling, reactive ion etching (RIE), wet etching, chemical mechanical polishing (CMP), dielectric deposition, and deposition and lift-off. The stepper offers a high-throughput production environment and runs on Windows, MAC OS, or Linux operating systems. In summary, 6300B wafer stepper is ideal for high-accuracy surface and thin-film analyses and is capable of handling complex applications with a high degree of accuracy and repeatability. It is designed for high-volume production and offers a range of features for an optimized process.