Used GCA DSW 8500 #293639852 for sale
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ID: 293639852
i-Line stepper
Illumination uniformity: <= 2.5%
System resolution: 0.8 μm L/S
Depth of focus: <= 1.25 μm
Reduction: +/- 0.10 µm
Rotation: <= 0.05 µm
Telecentricity: +/- 0.25 ppm
Global registration: +/- 0.25 µm T.I.R
Local registration: +/- 0.15 µm T.I.R
Open frame: No repeaters
Orthogonality: +/- 1.0 ppm
Stage precision: +/- 0.10 µm
Wafer levelling repeatability: +/- 10 ppm
Reticle aligner accuracy: <= 0.1 µm
Aperture blade repeatability: +/- 0.25 mm
Aperture blade skew: +/- 0.25 mm
RMS Realiability: 30 Cycles
AWH Precision: +/- 3.0 mils
AWH Reliability: 50 wafers
Focus repeatability: <= 0.30 µm T.I.R
Reduction repeatability: <= 6.0 ppm T.I.R
Optic:
Lens specification: 1635-I Tropel
Focal length: 86
Resolution: 0.8 µm
Image field: 16 mm
Wavelength: 365 mm
E.P. Location: 439 mm
Reduction: 1:5
Depth of focus: n+/- 0.75 µ.
GCA-GCA DSW 8500 Wafer Stepper is a high-precision, imaging equipment that is used in the production of integrated circuits and semiconductor devices. It is a high-resolution, high-precision device that combines both optical and x-ray imaging capabilities to accurately image, align, and pattern complicated structures. GCA-DSW 8500 features large scanning areas of up to 6 inches (152 mm) per wafer, multiple fully automated stages for accurate and repeatable imaging, highly accurate measurement and aligning devices for micro-scale imaging, and an expandable architecture with the ability to add additional stages and optics. The system is designed to be user friendly and require minimal set-up time, with a full-featured operator panel with an interactive graphics user interface (GUI) and a comprehensive set of tools. The unit includes a vacuum chamber that provides a clean, dust-free environment. The optics machine is driven by a high-resolution laser array, a x-ray source, and a long working-distance microscope. The optics tool is also equipped with an image processor and image processing software that can provide real-time data analysis and calibration capabilities. GCA-GCA DSW 8500 is powered by a fast processor and an 8" wide-field CCD imaging camera. It is controlled using the integrated IMAP (Image Mounted Alignment Process) software that enables both manual and automated patterning. GCA-DSW 8500 has a number of features designed to ensure that accuracy is maintained and variability is minimized. This includes a low noise environment, motion control systems to reduce vibration, and built-in self-testing and diagnostics capabilities to ensure maximum asset performance. By combining the latest imaging technology with advanced motion control systems, GCA-GCA DSW 8500 is able to provide high-resolution imaging at speeds up to 3 millimeters per second, with tight repeatability. This model provides a reliable, repeatable, and high-precision imaging platform, which makes it ideal for the production of high-precision electronic components and devices.
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