Used NIKON NES1 H4 #9239625 for sale

NIKON NES1 H4 is a high performance wafer stepper used in the fabrication of semiconductor devices. It is a two-stage, gantry-style, full-field optical lithography equipment that includes a proximity mask aligner, a top surface alignment system, and an immersion projection lens. Designed for efficient use of exposure time, it supports high Magnification, high Resolution, and high throughput, making it suitable for a wide range of fabrication processes. NES1 H4 employs a combination of features to ensure optimal wafer-level application of the semiconductor materials, including a high-precision, three-axis gantry - which provides the unit with quick movements and high-accuracy alignment accuracy. The top surface alignment machine helps ensure precision placement for each layer of material over the substrate, ensuring uniform layer distribution. Additionally, the tool's high-resolution optics ensure that extremely small features can be accurately and precisely created at a higher rate than what is possible with other wafer stepper systems. An additional feature of NIKON NES1 H4 is its full-field immersion projection lens that allows for a smooth optical path from the mask to the wafer surface. As the asset is designed to handle both multi-exposure and multi-layer lithography, the full-field immersion projection lens allows users to apply materials accurately with high resolution at a faster rate than is typically achievable. NES1 H4 is compatible with a variety of high-resolution support surfaces including epoxy, quartz, low-k dielectrics, and protective photoresists. It can provide field size up to 28 mm x 28 mm with an associated depth of focus of 6 to 30 μm, and its laser interferometry sensing can provide up to 0.1 micron of accuracy. In addition to ensuring accuracy for each layer, the model's stepper heads are designed for fast operation and feature vibration-free design. Overall, NIKON NES1 H4 is a versatile and powerful multi-layer lithography equipment that can provide high accuracy, high throughput, and precision placement of materials over a wide range of semiconductor applications. Its advanced features and wide range of compatible materials make it suitable for a variety of applications.