Used NIKON NSR 1755 i7A #9247254 for sale
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ID: 9247254
Stepper
Resolution: 0.5 µm
NA: 0.5
Exposure wave length: i-Line
Reduction: 1/5
Expose field: 17.5 x 17.5 - 13.4 x 20.1
Alignment accuracy: 0.12 (|x|+3s).
NIKON NSR 1755 i7A is a high-end wafer stepper equipment that is optimized for the development and manufacture of intricate micro-scale patterns. It has a maximum resolution of 0.3µm, and can process substrates as large as a 200 mm diameter. The stepper uses the patented NIKON N-Tilt stage technology, which allows for controllable high-accuracy alignment of the wafer during exposure. NIKON NSR 1755I7A also features an X/Y information technology that improves imaging accuracy. The imaging optics provide a reduction pattern of 0.14x and 0.4Gbps of throughput. NSR-1755I7A is powered by two powerful computers, one for the control system and one for the image processing and computation unit. The control machine offers a variety of programming capabilities such as a pair of macros for automatic process optimization. In addition, NIKON NSR-1755 I 7 A is capable of up to 288 binary control channels and nine axis of motion. The tool also includes a die velocity control device for the precise placement of defective chips. A Substrate Auto-Alignment unit ensures accurate alignment between the substrate and the exposure mask. NSR-1755 I 7 A's conformal exposure asset has a high rate of throughput and an average yield of greater than 99 percent. NSR 1755I7A is also equipped with a high-accuracy linear photo-alignment model. It features a high-speed exposure plotter, and is equipped with a real-time image processing equipment. The stepper also supports an on-board system for defect review and a continuous offer and accept unit that allows the machine to process multiple exposures. In addition, NSR 1755 I 7 A has a variety of advanced features that optimize the exposure process. Its x-shift and y-shift functions allow for accurate positioning of the mask relative to the substrate, while its differential focus compensation (DFC) feature automatically compensates for noise, focus, and distortion. Its auto-posting feature automatically compensates for critical dimension errors on wafers. Finally, its advanced design features enable alignment accuracy of up to 1/100th of a micrometer and maximum 3D z-axis control.
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