Used NIKON NSR 2205 i11D #9160392 for sale

NIKON NSR 2205 i11D is an advanced exposure system for device fabrication in the semiconductor industry. Developed by NIKON Precision, it is a compact and highly accurate stepper used for high-resolution patterning and exposure of photoresist layers on many kinds of wafers such as silicon, glass, and polymer. NIKON NSR-2205I11D is based on a newly developed i-line illumination source composed of an ultraviolet (UV)-LED array and a high-performance condenser lens. This system is designed to provide a uniform intensity and bandwidth of light that is highly suitable for high-precision pattern exposure of photoresist layers. It has a very low noise level, making it suitable for extremely sensitive device exposure processes. The system is highly accurate, featuring a maximum overlay accuracy of +/- 15 nanometers for 4-square images and +/- 25 nanometers for 8-square images. Additionally, the comprehensive features of NSR 2205I11D enable it to reduce line-edge roughness (LER) and maintain low DOF values. As such, it is ideal for advanced device fabrication processes, such as contact lithography and deep-UV feature patterning. The stepper's rigid structure and superior straightness of the travel axes ensure stable operation even during continuous operation. The power supply operates at a low voltage that greatly reduces electromagnetic noise. Furthermore, the excellent motor phase control function enables highly accurate exposure with 1/1000th of a degree repeatability and a +/- 2 nanometer accuracy. NIKON NSR 2205I 11D is equipped with a large wafer chuck and a low-tilt stage to ensure the stepper is capable of handling the repeatability and throughput challenges of the most demanding device fabrication processes. Its nanometer-level positioning accuracy ensures superior exposure uniformity, repeatability, and superb imaging quality. Its configuration also allows for a large depth of focus for low across-chip variation in lens performance. NSR-2205 I11D provides a high level of productivity thanks to its accurate, repeatable, and reliable performance. Its robust design makes it suitable for large-volume wafer processing and its specialized features enable it to meet the most challenging exposure requirements for today's semiconductor fabrication.