Used NIKON NSR 2205 i11D #9237764 for sale
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ID: 9237764
Wafer Size: 4"
Stepper, 4"
Panel: MPXIII
Chamber set temperature: Chamber / LLTC / IATC: 23°C
AGILENT / HP / HEWLETT-PACKARD / KEYSIGHT Laser: 5517B
LSA Laser: 7 mw
ITV Camera: NIKON Original
OF Detection type: NIKON Original
No in-line
Wafer type: Flat
Wafer loader type: Type 2
Wafer condition: SAPPHIRE
Wafer carrier table: Right
FIA
Reticle size, 6"
Reticle library slot: 13 Slots (3 Slots bad)
No barcode & PPD
Control rack PCB
Computer type: VAX 4000 96
Fiducial mark
CDA / Vacuum pipe
STG Guide
SHRINC Lens wheel belt.
NIKON NSR 2205 i11D is a high-end, versatile wafer stepper equipment engineered for advanced applications in the semiconductor industry. This device is capable of achieving superior results with a maximum resolution of 1.5nm or 13.5 nm field size with 10x yield. NIKON NSR-2205I11D offers a wide range of feature sets and flexibility. It is equipped with an innovative illumination system, providing adaptive multi-shot, dual-field and accelerated exposure technologies, enabling exposure over a broad exposure range with higher accuracy and precision. The device has an active axis control platform and an enhanced set of stitching capabilities, allowing for seamless pattern stitching and exposure. Also, this device includes automatic light amount control for higher feature accuracy. It has a chip size of up to 180mm, enabling large substrates and complex patterns. Additionally, NSR 2205I11D comes with an advanced imaging pick-up unit, delivering improved image definition and clarity, as well as higher magnification abilities. NSR 2205 I11 D is designed to offer reliable and optimized performance, while providing high-resolution imaging. It offers advanced wafer positioning, enabling the device to compensate for the different shape and positional errors of the wafer. Furthermore, it is designed to simplify operation through enhanced error reduction, allowing for an easier and faster operation. NSR-2205 I11D is an all-in-one machine, offering multiple features and capabilities in a single package. It is designed to meet the needs of a variety of high-end applications, from fabrication to die inspection. It offers improved speed, accuracy, and efficiency in high-precision and semiconductor operations, providing unmatched performance in a wide range of production processes.
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