Used NIKON NSR SF120 #9361374 for sale
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ID: 9361374
Wafer Size: 12"
Vintage: 2003
i-Line stepper, 12"
Main body
Loader chamber
Power supply box
Lamp house cooling unit
Exposing source: i-line
Wavelength: 365 nm
Surface illumination: 1000 mW / cm²
Reduction ratio: 1:4
Wafer alignment: FIA / LSA
LC Control: 25x33 mm
Step pitch: 25 nm x 33 mm, 76-Shots, 12"
Exposure amount: 90 mJ / cm²
Reticle buffer: 14 Sheets (Maximum)
(2) Reticle load ports
Throughput:
FIA-EGA: 100 Wafer / Hour
(2) LSA-EGA: 90 Wafer / Hour
Resolution: <280 nm
Alignment accuracy: <35 nm (M+3σ)
Projection lens NA: 0.50~0.62
Lighting NA with squeezing:
I-NA: 0.43 CONV
I-NA: 0.36 CONV
I-NA: 0.50 2/3Ann
(2) VRA Angle exposure range (Scan field):
26x33 mm
25x33 mm
Options:
PPD
Particle inspection device
2D Barcode
WL Front in-line
Relay FOUP unit
2003 vintage.
NIKON NSR SF120 is a fully automated wafer stepper, designed specifically for sophisticated wafer processing needs. This stepper offers a wide range of features, such as a superior pattern alignment equipment that ensures accurate overlay accuracy across multiple wafer levels. The 5-axis motion system also ensures precise wafer movements with a minimum of vibration for greater stability. NIKON NSR-SF120 also provides a high-precision lens unit that produces excellent wafer surface fidelity and improved performance. Advanced software and optics for a bright field imaging also guarantee excellent edge detection and sharpness. NSR SF 120 features a large 6-inch field of view that can accommodate most wafer shapes and sizes. Its high-resolution 10-megapixel camera gives outstanding imaging capabilities for accurate, repeatable wafer deposition process over the entire wafer surface. An automatic wafer calibration machine helps to reduce user input by setting the optimal exposure parameters for each product. This helps to ensure that all deposition processes are carried out with optimal precision and without any need for manual control. This stepper is also equipped with a host of features to enhance wafer processing, including substrate misalignment compensation, defect pattern identification, and wafer-level overlay preview for improving the quality and repeatability of the stepper. NSR SF120 also features ideal temperature control to maintain the best conditions for wafer processing. It employs a high-precision pressure chamber, which helps to control temperature drift, humidity, and contamination levels on the wafer surface. Air-jet stage cooling technology is also used during depo
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