Used NIKON NSR SF200 #9222705 for sale
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ID: 9222705
Wafer Size: 8"-12"
KrF Stepper, 8"-12"
Minicomputer system
Liquid crystal monitor
Operational panel
Stage controller
Alignment controller
Panel controller
Lens controller
Wafer loader controller
Reticle loader controller
S/G Conversion unit
Signal monitor unit
Stage power amplifier
Reduction projection optical system:
Reduction ratio: 1/4
N.A: 0.50 - 0.63 (Variable)
Lens distortion: ≦±20 nm (Including magnification error)
Exposure area: 26 mm x 33 mm
Exposure wavelength: KrF Excimer laser (248nm)
Wavelength stability: ±0.10 μm
Spectral bandwidth (FWHM): ≦0.8 μm
Illumination optical system:
Maximum exposure frequency: 2000 Hz
Illumination uniformity: ≦±1.0%
Integrated exposure accuracy: ±1.3%
Integrated exposure matching: ±1.2%
Dose setting range: 1mJ/cm2-1J/cm2 & 0
Coherency factor: 0.3-0.8 (Lens NA 0.63)
Auto reticle blind system:
Blind configuration: Focused type
Minimum blind setting range: 2.0 mm x 2.0 mm
Setting accuracy: +0.4 mm to +0.8 mm
Reticle interferometer system:
Configuration: Three axes (X, Y, θ)
Interferometer minimum reading unit: 1.2 nm
Reticle table:
Configuration: Three axes (X, Y, θ)
Stroke: ≧±1.1 mm for each axis
Angle of rotation: ±1°
Reticle holder: 6"
Position control: Closed-loop servo control
Reticle alignment system:
Reticle loading: Automatic from reticle loader
Alignment method: Bright-field off-axis under
Broadband illumination TV image processing
Observation system: Display on ITV monitor
Field image alignment (FIA) system:
Observation system: 79x / 490x
Functions:
Fine alignment
Search alignment
Visual observation during manual assist mode
Auto focus system:
Detection method: Broadband light detection (Multi point sensor)
Repeatability: ±100 nm
Vertical stroke: 0.6 mm
Focus offset input range: ±10 μm
Auto focus tracking range: ±0.3 mm
Auto focus spot: Maximum 9 points selected from total 29 points
Auto leveling system:
Detection method: Broadband light detection method (2 Dimension multi point sensor)
Target plane: Image plane of projection lens
Accuracy: ±1.5 sec (Relative to the target plane)
Repeatability: ±1.0 sec
Leveling offset input: ±10 sec
Amendable tilt: 2.6 minutes (Relative to wafer backside)
Wafer interferometer system:
Configuration: Five axes (X1, X2, X3, Y1, Y2)
Minimum reading unit: 0.6 nm Each axis
Laser wavelength correction: Automatic
Wafer X-Y stage:
Stroke: ≧300 mm in X and Y directions
Positioning control: Closed-loop servo control
Using laser interferometer
Stepping precision: 18 nm
Array orthogonality: ≦±0.1” (After correction by software)
Wafer table:
Wafer table rotation angle: ±1°
Wafer holder: 300 mm / 200 mm
Reticle loader:
Storage capacity: Standard 10
Reticle:
Size: 6 x 6
Thickness: 0.25"
Material: Quartz glass
Type: Low-reflective chromium mask (Single-layer chromium)
Options:
Test reticle
Extended wafer carrier table
On-line application
Laser step alignment (LSA)
Lithography information control system (LINCS)
Reticle bar-code reader
Extended reticle library
FU
PPD
R.E.T (Resolution enhancement technology)
Power change (Correspondence high sensitivity resist with ND filter).
NIKON NSR SF200 Wafer Stepper is an advanced semiconductor lithography equipment that can provide tight process control and accuracy to produce high-quality semiconductor products. Designed for use in high-volume production, NIKON NSR SF 200 provides an advanced level of performance that can meet the stringent requirements of multiple projects. The system is designed to handle a variety of substrates, including silicon wafers, metal plates, and quartz encasements. NSR SF200 is a multi-beam unit, capable of handling up to sixteen exposures simultaneously. Featuring both a built-in laser machine and a custom designed, electrostatic micro-mirror array, such highly parallel capabilities contribute to its excellent performance and significantly reduce production times. In addition, the tool includes a high-level optical module that ensures precision alignment of the wafers. This is accomplished through a fine optical tracking asset that allows precise allocation of the substrate to the proper beam. The model is equipped with a number of image processing tools that support patterning, distortion correction, and mask qualification functions. These tools enable the equipment to process small patterns to those with higher resolution, including those used for high aspect-ratio layers. In addition, the system offers a wide range of advanced overlay optimization techniques for improved overlay accuracy and uniformity on any wafer size. The unit is equipped with a variety of automation capabilities that enable them to run unmanned operations. This includes an automated calibration machine and a job scheduling tool. The software also helps engineers analyze their wafers using a number of optical inspection and simulations systems. NSR SF 200 is well-suited for a wide range of applications, including MEMS, optoelectronics, and integrated circuit fabrication. With a variety of features and automation capabilities, the asset contributes to improved efficiency and quality in production. It provides tight process control, capable of meeting the stringent requirements of large-scale projects. The multi-beam model and the custom designed, electrostatic micro-mirror array enables the engineers to simultaneously process multiple wafers in high-volume production, ensuring time and cost savings. Its impressive range of features and capabilities make NIKON NSR SF200 a powerful and efficient tool for the production of high-performance devices.
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