Used NIKON S207D #9309609 for sale

NIKON S207D is a state-of-the-art wafer stepper with an advanced level of accuracy and precision. Equipped with the latest stage technology and motion control technology, it is capable of producing high-precision slit-shaped images on the wafer surfaces in nearly any production environment. This allows for the precise printing of fine patterns on the wafer surfaces for the advancement of semiconductor processing. The stepper is equipped with a 4-axis direct drive, which is capable of sweeping and scan-aligning the wafer over the objectives, providing usage in a wide range of applications. It features an ultra-high accuracy of ±10µm or less, which contributes to improved yields. It can reach scan-align speeds of up to 50 seconds per wafer, which can dramatically increase the throughput of production cycles. S207D also features an advanced laser based alignment equipment, which can provide precise placement of images. This system accurately measures the size and shape of the objectives, allowing for the accurate placement of images. The unit also monitors wafer warping during the exposure in order to ensure optimal image placement. The stepper is also equipped with an advanced multi-point optical machine, which provides a wide field of view. This tool provides a viewing angle up to 180°, allowing for the inspection of the entire wafer surface. It also allows for the inspection of wafer front, backside, and sidewalls. Furthermore, this level of precision is aided by a high-stability machine bed. This bed is designed to provide sidewall support to the objectives in order to maintain the alignment accuracy of the objectives and ensure the quality of the images printed. The level of accuracy and precision ensured by this asset allows for industries to quickly and efficiently produce wafer chips for their production demands. In short, NIKON S207D wafer stepper is a state-of-the-art piece of equipment that can provide an unprecedented level of precision and accuracy when working with wafers in production cycles. This allows for industry to quickly and efficiently produce their wafer chips for their production demands. With its advanced motion control technology, 4-axis direct drive, laser based alignment model, and multi-point optical equipment, it is capable of producing slit-shaped images on the wafer's surfaces with an accuracy of ±10µm or less. This ensures a high quality and yield of products.