Used ULTRATECH 2700 #9312331 for sale

ULTRATECH 2700 Wafer Stepper is an automated and computerized lithography equipment for semiconductor products. It is specifically designed to apply thin layers of film to a wafer, advancing the wafer through a series of lenses and imaging systems with a variety of film types and settings. 2700 has a field of view of 12 by 12 inches, and a depth of focus of ± 3.5 μm. It is capable of exposure times from 1 to 20 s, making it suitable for various different applications. The main components of ULTRATECH 2700 Wafer Stepper include a projector, set of lenses, pod, wafer cassette, stepper head, and control computer. The projector is responsible for projecting the pattern on the wafer, and the lens system is used to vary the size of the field of view. The stepper head is responsible for moving the wafer across the field of view in a precise manner. The pod is used to exchange wafers between the cassette and the stepper head. The wafer cassette is used to hold the wafer during processing. Finally, the control computer is responsible for controlling the movement of the wafer and managing the exposure of the film. 2700 Wafer Stepper is capable of processing wafers up to 8-inchs in diameter, and is capable of speeds of up to 3.6 Hz (3.6 exposures/second). It can handle multiple wafer sizes, and its advanced control unit ensures precise alignment during exposures. Its onboard diagnostics machine monitors exposure and provides feedback on any issues. Its advanced thermal management tool ensures that the asset remains thermally stable throughout the entire process. Finally, ULTRATECH 2700 Wafer Stepper includes a range of helpful features, such as a calibration procedure that helps reduce scatter due to incorrect focus adjustment, and an auto-create option that allows the user to quickly set up the model for a specific job. It is capable of handling a wide range of film types, including in-situ defocused process films and dry-process films. Overall, 2700 Wafer Stepper is an advanced, automated, computerized lithography equipment designed specifically for semiconductor processing. It is capable of processing wafers up to 8-inchs in diameter, and offers high precision and accuracy across a range of exposure times. Its advanced control system ensures precise alignment during exposures, while its helpful features, such as its auto-create option, help reduce time spent setting up jobs.