Used ULTRATECH AP200 #9225121 for sale

ULTRATECH AP200
Manufacturer
ULTRATECH
Model
AP200
ID: 9225121
Wafer Size: 8"
Vintage: 2010
i-Line stepper, 8" 2010 vintage.
ULTRATECH AP200 is an advanced wafer stepper, designed to create high resolution photolithographic masks of flat substrates with extreme accuracy. This stepper is designed for hard-to-reach curves and sharp alignment features. It is also suitable for dielectric, light-sensitive, and buried layer patterning. The stepper is capable of 8"- 300mm wafer sizes with flexible options in design rule density, layer counts, accuracy, repeatability, and field sizes. It offers 4-6 micron horizontal linear resolution, and 0.13 micron vertical/z axis resolution for various alignment operations. The stepper also has an unsurpassed field overlap for maintaining exacting pattern registration. ULTRATECH AP 200 features a high-energy Photo Print Head system which is capable of Pulse Amplitude Modulation (PAM) technology. This feature gives the ability to precisely modulate the output of the print head to better match the intensity profile of specific brush patterns, reducing pattern distortion. It is also designed with an array of exposure sources including KrF, ArF, HeCd, and broad-band UV. In addition to high-resolution imaging capabilities, AP200 incorporates advanced control features such as field, lattice, and isolated pattern exposure, plus post-exposure baking. A full array of wafer-level and substrate-level inspection is also provided. These advanced processing functions include Automated Parameter and Recipe Manager (the ability to save, retrieve, and modify parameterized recipes), and automated Thermal Profiling (which allows for fast and reliable precision temperature adjustment). AP 200 is a leading wafer stepper for large photolithographic mask fabrication. Its high-resolution imaging and multiple exposure capabilities make it an ideal choice for production of flat panel displays, interposers, multi chip packages, and other advanced semiconductor fab applications. Its robust features, such as exposure sources, wafer-level and substrate-level inspection, and automated parameter and recipe management, make it a reliable and cost-effective solution for demanding photolithography processes.
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