Used ULTRATECH Sapphire 100 #293649647 for sale

ULTRATECH Sapphire 100 wafer stepper is an advanced lithography equipment designed for photomasking in semiconductor applications. Sapphire 100 is capable of processing up to 6-inch diameter wafers with a precision of 2 microns. It also offers various overlay alignment and throughput options to ensure accurate patterning of high-density arrays or complex structures. ULTRATECH Sapphire 100 is equipped with a dynamic focus system, a 6-inch standard lens and advanced imaging capabilities, including an adaptive observer that allows for the dynamic adjustment of exposure parameters for maximum pattern accuracy. Sapphire 100 also allows for the selection of a range of different exposure parameters, including exposure time, dose, and number of pulses. The unit features a proprietary NEGAπ photomask program that can be used to accurately align structures with micro-level precision of up to 6 microns. ULTRATECH Sapphire 100 has the ability to process a variety of material types, including Silicon, Gallium Arsenide and Silicon Germanium, as well as thin films with a thickness of up to 1000 Angstroms. The machine is bi-directional, meaning that it can be used to expose gratings produced either in contact mode or with proximity contact printing. Sapphire 100 has an on-board robotic handler for automatic wafer loading and unloading, as well as a digital energy meter for accurate energy readings. In addition, the tool utilizes advanced optics, including rotatable illumination, to ensure optimal light transmission. ULTRATECH Sapphire 100 includes two different control options—a customer-defined control asset and an Auto-exposure/Intelligent Lighting model, which allows the user to set and control exposure and focus parameters without any external hands-on intervention. The equipment is also capable of real-time monitoring, which provides fast feedback on the results of the lithography process. Sapphire 100 is designed for rapid and accurate photomasking for a wide range of applications. Its combination of adjustable exposure parameters and precise lithography capabilities allows for the accurate patterning of complex density structures or very small structures. The system's combination of advanced optics, automated wafer handling, and intelligent lighting further ensure optimum lithography results to meet the highest standards of performance.