Used ULTRATECH Unity AP300 #9247822 for sale

ULTRATECH UnityTM AP300 is a versatile, high-precision wafer stepper for precision lithography exposure of microelectronic devices. It is designed for high-throughput production of submicron devices, with a sub-micron registration capability around the entire die size. It features next-generation processing technologies, including Work Management, Aperture Design, Multi-Layer Patterning, and Overlay Alignment. It utilizes a UV illumination source with 75 um numerical aperture. It supports both step-and-repeat and full-field pattern projection exposures. It has a patented, tiltable reticle holder, which simplifies exposure programming, pattern exposure and alignment. Additionally, it has an innovative, user-friendly vacuum equipment which minimizes contamination and rejects built up on the platform. The system has a precision servo-controlled stage for the moving the substrate and a high-resolution encoder for precise position feedback. It features an independent, dual-noncontact probe unit for high overlay alignment accuracy. Its holder design enables quick and easy wafer loading, manipulation, alignment and exposure of a high-density dies. It also allows easy access to the reticle and has a self-monitoring transport machine. It also has a networked monitoring tool to ensure efficient production and process integrity. The controller includes both a PC-Compatible PC and a dedicated ULTRATECHTM Progmatic 2.0 controller. The PC-Compatible PC is a high-end, multi-processor asset with a full suite of PC applications. This model includes a user-friendly interface enabling die design, reticle setting, and neural network-driven process optimization. The Progmatic 2.0 Controller is a true open-architecture, multi-tasking robotic controller that manages stepper automation and machine functions. It provides a wide range of sophisticated capabilities to meet the high-end performance and reliability required for high-volume lithographic production. ULTRATECH UnityTM AP300 has been designed to meet the highest-quality lithography requirements, achieving an exposure accuracy of 0.3um (3.0σ). It also delivers a high-speed exposure of 20nm and higher, enabling high-throughput production of advanced and ultra-small devices. It meets the toughest lithography requirements for low-power, high-performance integrated circuits. Overall, it provides a cost-effective solution for high-precision, ultra-reliable lithography exposure and production of advanced microelectronics.