Used ACCRETECH / TSK RVF600A #9410239 for sale

ACCRETECH / TSK RVF600A is a wafer testing and metrology equipment designed for high-throughput wafer inspection and evaluation. It is capable of measuring electrical characteristics, analyzing defects and surface measurements such as roughness and flatness. The system includes a high-resolution imaging unit that is capable of detecting defects as small as 0.15 μm and a wide range of pattern types such as circular, linear and diagonal patterns. TSK RVF600A offers a variety of testing and metrology capabilities, including plasma etching, photoresist stripping and deep trench metrology. It is equipped with a built-in library of test recipes and advanced image processing algorithms that allow for rapid analysis of wafers. The machine is capable of inspecting wafers up to 200 mm in diameter, and is compatible with multiple wafer types including silicon, SOI, silicon-on-glass (SOG), sapphire and sapphire-on-glass (SOG). ACCRETECH RVF600A's built-in metrology capabilities are designed to help users accurately measure and analyze the surface of a wafer. These features include surface roughness evaluations, flatness evaluations, and depth measurements. The tool also supports a variety of pattern inspection tasks such as focus/defocus, alignment/localization, overlay correction and defect evaluation. Additionally, RVF600A includes a highly advanced image-based inspection and defect detection modes. These features allow the asset to acquire, compare and analyze multiple views of a wafer's surface at the same time, enabling comprehensive defect detection and analysis. Overall, ACCRETECH / TSK RVF600A is a powerful wafer inspection and analysis model, equipped with a suite of advanced testing and metrology capabilities. It is designed with a focus on speed, accuracy and precision, and provides users with a comprehensive solution for wafer inspection and characterization.