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1745 RESULTS FOUND FOR: used Wafer Testing And Metrology

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  • ADE / KLA / TENCOR 350

    ADE / KLA / TENCOR: 350

    Robot arms Part No. 353-071-0071 Arm: 022256-02 ASM P/N: 78-115406A05 Brief approximate: 2 Arm links: 8" Bottom diameter approximate: 10" Top mount flange size approximate: 12.5" Overall length approximate: 36.5" Power requirements: 110 V, 50-60 Hz.
  • ADE / KLA / TENCOR: AFS 3220

    Wafer surface measurement system.
  • ALLWIN21: AWgage 200

    Metal film metrology system, 4"- 8" Main frame Measurement head Non-contact sheet resistance measurement Measurement range: 1m W/sq to 19,990 W/sq Consistent wafer-to-wafer process cycle repeatability Wafer carriage travel programmed: With internal encoder step motor Without encoder disk Test sights: Single center-point (5) Points (9) Points Highly conductive or metal sheet resistance: 1 to 1,999 mW/sq 1 to 1,999 W/sq 10 to 19,990 W/sq Highly conductive or metal film thickness minimum: 100Å (Ångström) Maximum: Proportional to resistivity Maximum for a resistivity of 2.7 mW: 270 kÅ (27 mm) Sheet resistance repeatability: Range s/X (±%) 1 to 100 mW/sq 1 100 to 500 mW/sq 2 500 to 1000 mW/sq 4 1000 to 1,999 mW/sq 6 1,999 to 5,000 W/sq Consult factory 5000 to 10,000 W/sq Consult factory 10,000 to 15,000 W/sq Consult factory Boards: RF Tank circuit Pentium® class computer Main control Motor control Ports: (2) USB (2) Extra DB9 Touch screen GUI, 15" Mouse & keyboard Room temperature: 23° C Power: 50/60Hz Single phase 110/220VAC 2 Amps CE Marked Wafer loading: Manual.
  • BRUKER / SLOAN DEKTAK: XT

    Probe profiler, 4".
  • BIORAD PX 1

    BIORAD: PX 1

    Foils microplate plate sealers 2014 vintage.
  • CANON LSF 500

    CANON: LSF 500

    Flatness tester Includes: Metal box Discs Lenses Fuses.
  • CORNING / TROPEL 128892-7000

    CORNING / TROPEL: 128892-7000

    Metrology testing systems Measure pole movement with nanometer accuracy 2003-2004 vintage.
  • CHAPMAN: MP2000

    Surface Profiler.
  • DNS / DAINIPPON: VM-8200

    Film thickness measurement systems, 8".
  • DNS / DAINIPPON: LAW-815A

    RTA System, 6" 1993 vintage.
  • FOUR DIMENSIONS CV92-A

    FOUR DIMENSIONS: CV92-A

    Mercury probe CV mapper, 8" Embedded computer and a PC Drawer for receiving the wafer CV map software power: 100 / 115 / 230 VAC, 50/60Hz 300 W Compressed air 60 psi Minimum vacuum 28 in. Hg at 22 l/min Minimum table footprint: 20 x 22 x 13.
  • FSM / FRONTIER SEMICONDUCTOR FSM 413

    FSM / FRONTIER SEMICONDUCTOR: FSM 413

    Wafer thickness measurement system 2013 vintage.
  • FARO 3D Platinum

    FARO: 3D Platinum

    Measurement arm, 4" Control Station Platinum 4: Part no. CS-P0402-21 Touch screen computer 6-axis Soft check tool manager software with developer's kit CAM2 measurement software Computer support arm Mounting plate (1) 3 mm Zircon hard probe (2) 6 mm Zircon hard probe Granite rolling cart: Part no. ACCS0164 Granite surface plate with toe clamp inserts (2) Integrated FaroArm mounts Locking heavy duty casters Locking cabinet doors (52) Piece toe clamp set Magnetic mount (arm and FLT): Part no. SM029 Magnetic base Not included: Digital camera Computer.
  • HITACHI: VR-120/08S

    Resistivity test system, 12" 2002 vintage.
  • JMAR Mirage S2610-01

    JMAR: Mirage S2610-01

    Automatic wafer circuit inspection measurement system, 3-axis Objectives: 10x and 50x DATACON Pentium 2 Tower computer 14" VIEWSONIC 15GS monitor Fiber optic light power supply VideoCMM II Software versions 2.01 on CD Screw-in pegs for lifting unit Passive Vibration Isolation Illumination Sources: 3 Channel digital light control Transmitted, incident and oblique lighting Resolution: 1, .5. or .1µ Repeatability: <1µ Accuracy: 3µ Field-of-view Resolution and Accuracy (using 100x objective): Resolution: .05µ Accuracy: .02µ or better.
  • ISIS SENTRONICS SemDex 301-2

    ISIS SENTRONICS: SemDex 301-2

    Wafer metrology system 2010 vintage.
  • KLA / TENCOR / ICOS T830

    KLA / TENCOR / ICOS: T830

    Fully automatic inspection system P/N: 0526600-000 xPVI: Top & bottom 3D Wave Gull wing 3D inspection Component height measurement on BGA Component height caliber (11.25 x 11.25 x 1.2) Component height caliber, TBD SPC & Image review tool Unit level traceability (Datamatrix) OCR Verification on mark teach Directional grouping Advanced QFN2D/5S parameters Advanced metrology 5-Lanes with (4) single reject trays XY Automated dual row Automated (4) inline sorting heads Pocket integrity check (5) Ionizer kits (40) Pads, TBD USB Barcode scanner Vacuum pen kit Tray orientation kit (28) Nozzles O-Ring, diameter 3.5 mm Display, 22" P/N: 0595046-000, Dent module 5S BGA/QFN Matrix mirror block P/N: 0597136-000 System, OS test handler P/N: 0602634-000 Kit, T8x0 OS docking OS6 Conversion kit P/N: 0616633-000 Upgraded T8x0R1, integrated tray bar code reader Top DOL/FLB on IS2 P/N: 0613954-000 Kit, slim btm brushing, T8x0 P/N: 0603462-000 Kit, T8x0, light curtain 2016 vintage.
  • KLA / TENCOR / PROMETRIX FT-500
  • KLA / TENCOR / PROMETRIX: FT-750

    Film thickness mapping system.
  • KLA / TENCOR / PROMETRIX: NC 110 OMNIMAP

    Film thickness measurement system, 4"-8".
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