Used ADVANCED ENGINEERING AWC-650 #147891 for sale
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ID: 147891
Wafer Size: 8"
Automatic wafer cleaner, 8"
Features:
Micro processor controlled operation:
Digitally controlled by on-board PLC controller
Cleaning process recipes stored and readily recalled from PLC memory
Substrate handling:
Accepts wafers up to 8" on dicing frames
Dicing frame positioned on system chuck using (2) location pins and spring-loaded hold-down mechanism
At end of process, wafer released from vacuum hold-down by puff of nitrogen
Standard atomizer cleaning head
High-pressure DI water nozzle (optional)
Built-in vacuum generator with auto-drain water trap
Dicing frame safety lock chuck
Built-in exhaust blower (optional)
System options:
Megasonic cleaning jet: uses megasonic-energized DI water
CO2 bubbler to prevent ESD on substrate
Custom chucks
Specifications:
DI water pressure (input): 5 to 7 bar
DI water capacity (maximum usage): 1.8L/min
DI water capacity (minimum): > 3 L/min
Nitrogen (maximum consumption): 70 NL/min
Air (CDA) (maximum pressure): 0.5 to 0.7 Mpa (5 to 7 kg/cm^2)
Air (CDA) (maximum consumption): 250 NL/min
Electrical: 115/230VAC, 50/60Hz
Power (maximum): 1.8kVA.
ADVANCED ENGINEERING AWC-650 is a versatile and lightweight wafer testing and metrology equipment designed to provide versatile, accurate, and repeatable electrical test results. It features the latest in wafer testing and metrology technologies, ensuring efficient and precise measurement and testing of a wide array of wafer products. It can be used for various types of production testing, research, and development applications. AWC-650 allows users to test a variety of semiconductor devices, including transistors, diodes, optocouplers, and logic ICs. The system offers multiple parameter testing capabilities including resistance measurement, capacitance measurement, voltage application, and voltage regulation. It also offers a wide range of testing accuracy for each parameter, ranging from 0.1% up to 0.001%. ADVANCED ENGINEERING AWC-650 has a user-friendly software interface and an intuitive operator panel, which can simplify wafer testing and reduce setup time. It features a comprehensive memory capability and multi-test parameter management unit. This provides users with ample flexibility and control when setting up and running tests. AWC-650 has a highly accurate surface mapping machine, which is capable of capturing microscopic images and automatically establishing optimal measurement locations with millimeter accuracy. The tool features micro-displacement technology, enabling users to measure resistivity even on extremely small micro-plates. It can measure up to five full plates in one process cycle and provide measurements of up to five samples simultaneously. ADVANCED ENGINEERING AWC-650 has a modular design which allows for easy customization. It can be equipped with various modular accessories such as probe plates, contact blocks, automation tools, test assemblies and test heads, as well as additional software, to enable faster and easier wafer testing. It is a reliable and flexible test and metrology asset, which is ideal for a range of production and research applications, providing repeatable and accurate test results.
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