Used ALESSI / CASCADE CPS-7089-17 #9293187 for sale

ALESSI / CASCADE CPS-7089-17 is a wafer testing and metrology equipment based on a combined optical and wafer-mapping platform. Its optomechanical design enables high-precision measurement for a variety of wafer test and metrology applications. Its advanced features, such as automatic wafer centering, support the automated testing of today's sub-micron devices. The system incorporates various optical components, including microscope objectives, sensors, and lenses. All optical elements are designed to provide optimal fit, allowing for the advancement of imaging technology required for current wafer test and metrology applications. The optomechanical design of ALESSI CPS-7089-17 allows for precise alignment across the entire field of view, ensuring the highest accuracy of test and metrology measurements. CASCADE CPS-7089-17 is equipped with a motorized stage, allowing for easy and precise wafer positioning. This is advantageous for high throughput testing and metrology operations. The motorized stage also allows for the ability to scan wafers of any size. To ensure all measurements are accurate across the entire field of view, CPS-7089-17 includes a variety of features, such as auto focus, auto exposure and advanced pattern recognition algorithms. The auto focus feature utilizes an auto focusing function, enabling users to quickly obtain the desired focus point, eliminating the need for manual adjustment. Automated exposure enables precise measurements regardless of the device design, offering a more efficient testing process. ALESSI / CASCADE CPS-7089-17 also features SPCi software, developed by ALESSI, which provides wafer test and metrology data analysis capabilities. This includes high precision performance metrics such as overshoot/undershoot and total area measurements. The software allows for easy setup and calibration of the unit and is also capable of advanced statistical analysis of wafer test and metrology data. ALESSI CPS-7089-17 performs a wide range of wafer test and metrology tasks, including die-to-die, individual die, and wafer-level measurements. This machine is an effective solution for automated testing and high accuracy metrology requirements for integrated circuit devices.