Used AMAT / APPLIED MATERIALS VeraSEM 3D #293668733 for sale

AMAT / APPLIED MATERIALS VeraSEM 3D is a powered wafer testing and metrology equipment designed for use in semiconductor technology and manufacturing. Its capabilities include advanced metrology, wafer maps, post-processing of 3D topography, qualification of gridded wafers, mask testing, and right angle-inspected surfaces. The tool is equipped with several components including a multi-channel electron beam source, a control console, and a user interface. The electron beam source delivers controlled pulses of electrons to the sample surface, allowing for high-resolution imaging and topography measurement. By using a combination of acceleration, deceleration, and beam deflection through the electron column, AMAT VeraSEM 3D can measure and map the contour of small features, non-planar features, and finely detailed surface textures. In the inspection, the electron beam is scanned and the secondary electrons generated in the interaction are used to collect an image or data for the 3D surface map. The control cabinet provides on-board image and data processing capability for collected data acquired from APPLIED MATERIALS VeraSEM 3D. Through this system, various parameters and functions are controlled and monitored. It can be used to adjust the current density of the electron column, the length of acceleration and deceleration phases of the scanned electrons, and other parameters. VeraSEM 3D user interface is designed for easy operation and data management. It can be used to monitor the unit and to visualize the collected images and 3D surface maps. Furthermore, the user interface is used to define the scanning areas, viewing modes, and the 3D topography measure settings. It also provides a recording function for storing the testing data, as well as allows for customization of the user interface. With its advanced metrology capabilities, AMAT / APPLIED MATERIALS VeraSEM 3D is an ideal candidate for the emerging applications of semiconductor testing. By using a combination of high resolution imaging and data processing, it can accurately measure and map small and non-planar features on a wafer surface. Its user-friendly interface makes the machine easy to operate and allows for customization according to the requirements of a particular application.