Used AMAT / APPLIED MATERIALS VeraSEM 3D #293702601 for sale
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APPLIED MATERIALS VERASEM 3D is an advanced wafer testing and metrology equipment that is designed to measure attributes of chips on a wafer such as area, thickness, height, width and volume. At the core of APPLIED MATERIALS VERASEM 3 D is the high-speed 3D imaging system, which uses advanced illumination technology to capture a full three-dimensional image of each device on the wafer. The unit then analyzes the topology of the wafer to precisely measure individual device attributes. The proprietary lighting and imaging machine works in conjunction with a powder-accurate data collection and mapping tool to accurately measure a variety of attributes. VERASEM 3D also offers systems that measure die height, thickness, and other parameters such as runout and particle count, with 0.001 micron resolution. This highly accurate measurement asset can extract extremely detailed information from a single-wafer scan, including identifying features or advantages of chip layouts such as crystallographic orientation, and other parameters on the thickness of a die. VERASEM 3 D also features automated report creation features, allowing engineers to quickly generate automated reports and data sheets from the collected images, which can then be used for design and performance optimization. The model also comes equipped with a feature that allows for rapid customer feedback and reporting over the internet, allowing for fast and easy analysis of chip performance. Furthermore, the equipment is automated and compatible with a variety of production protocols, such as ISO and non-ISO based production schematics, solving a variety of customer challenges. Data can be easily integrated into industrial automation systems and the VeraSem can be easily and quickly adapted to any industry standard or customer/corporate specific protocols. The system is also a great tool for production and development engineers to gain a better understanding of chips and wafer functionality. It allows engineers to quickly and accurately identify and optimize areas of chips where certain parameters are outside of design requirements. Additionally, APPLIED MATERIALS product support is available for customers interested in utilizing the advanced features of the unit. In conclusion, APPLIED MATERIALS VERASEM 3D is an advanced wafer testing and metrology machine designed to measure a variety of devices on a wafer. Its high-speed imaging and data collection tool can give engineers detailed information about their devices' topography, thus allowing them to quickly identify areas for further optimization. The asset also offers automated reports, rapid customer feedback over the internet, and is compatible with a range of production protocols.
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