Used AMAT / APPLIED MATERIALS VeraSEM 3D #9145247 for sale
AMAT / APPLIED MATERIALS VeraSEM 3D Wafer Testing and Metrology Equipment is an advanced system used to measure thin films and integrated circuit processes with true 3D images. This unit combines Autonomous 3D Measurement and Analysis technology with electron microscopy to bring a new level of data accuracy and precision to the semiconductor and wireless industries. AMAT VeraSEM 3D uses an advanced electron microscope to measure extremely thin films, defects and other features in integrated circuits. This process provides a three-dimensional image of the material in order to accommodate tilted feature walls and movements, which means less measurement errors and more accurate results. The precision of the machine is also improved by direct imaging of individual features and structures, reducing the need for complicated calibration and reference points. The versatility of APPLIED MATERIALS VeraSEM 3D Wafer Testing and Metrology Tool can be used in a variety of applications such as failure analysis, metrology and process control. Its innovative design makes it capable of measuring a variety of material types, including those found in modern FTIR, SPM and SEM systems. In addition to measuring thin films and integrated circuits, VeraSEM 3D also has extensive traceability capabilities to ensure accurate results and measurements over time. This is provided through an integrated configuration asset that allows for the creation of distinct traceability metadata directly from the imaging model. AMAT / APPLIED MATERIALS VeraSEM 3D Wafer Testing and Metrology Equipment is a powerful tool for measuring and analyzing the structure of thin films and integrated circuits. It combines Autonomous 3D Measurement and Analysis technology with electron microscopy to produce high-quality 3D images with precision and accuracy. It is capable of measuring a wide range of materials, as well as providing traceability capabilities to ensure long-term data accuracy and consistency. This makes it a powerful tool for failure analysis, metrology and process control.
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