Used ASML YieldStar S250 #9359414 for sale

ASML YieldStar S250 is a wafer testing and metrology equipment that is designed to enable rapid and reliable measurement of wafer parameters, enabling increased yields and consistently high quality. The system features an integrated 300mm in-line metrology module with a high-throughput architecture. This enables it to measure wafer parameters such as sheet resistance, lateral profile, defect density, and thin film thickness, as well as associated device parameters e.g. dopant levels, oxide layer thickness and residual stress distribution. OCR and OGI devices can also be used to detect issues such as cracking or particle settling. The unit is capable of testing both silicon and non-silicon wafers with unprecedented speed and accuracy. It uses advanced calibration techniques and an optimized overhead field of view, allowing the machine to take accurate measurements even when the wafer is not centered. This ensures that the tool is reliable and repeatable in its performance. In addition, the asset features a laser interferometry model to measure intra-die critical dimensions to resolutions of one nanometer. This enables the equipment to accurately determine the patterned structures on each die, as well as their placement with respect to one another. YieldStar S250 also features numerous safety features and techniques for preventing data loss or other issues. It is designed to operate in a controlled environment, with a real-time screen monitoring system for closed-loop process control and automated unit checks for diagnostics and fault recovery. All of these features combined make ASML YieldStar S250 an ideal machine for monitoring and analyzing the quality of wafers during mass production. By using this tool, manufacturers can detect issues early on, thus improving overall yield and reliability.