Used BOECKELER INSTRUMENTS 1-M (N) #9397651 for sale

BOECKELER INSTRUMENTS 1-M (N)
ID: 9397651
Junction depth measurement system.
BOECKELER INSTRUMENTS 1-M (N) is a wafer testing and metrology equipment designed to increase the accuracy of die-level inspection and measurements. This system offers a range of capabilities, including metrology measurements, inspection capabilities, and advanced analytics. The basic unit configuration of this machine comprises a complete analytic test station, a 3-axis motorized positioner, and a high-resolution camera. The 3-axis motorized positioner allows for precise wafer alignment during testing, while the camera uses high-resolution imaging to capture details for analysis and inspection. The advanced analytics capabilities of the tool allow for die-level measurements, including die-height measurements, parametric analysis, and low-magnification analysis. The asset also offers a range of inspection capabilities, including surface condition analysis, flatness analysis, defect detection, and deformation inspection. The model is designed to provide fast, accurate, and reproducible testing and metrology results. The three-axis motorized positioner allows for rapid sample setup, while the advanced analytics ensure results are precise and reproducible. In addition, the equipment includes features to ensure the accuracy and integrity of results, such as a dynamic thermal control system with temperature feedback, an automatic calibration script, and an image quality monitor. BOECKELER INSTRUMENTS 1-M (N) utilizes a range of intelligence software and systems to ensure comprehensive metrology measurements, inspection, and analytics. It is also designed to work with a range of materials, from silicon and metal to plastics and composites. This unit is highly versatile and can easily be integrated into existing automated wafer inspection and manufacturing systems. Overall, BOECKELER INSTRUMENTS 1-M (N) is a powerful wafer testing and metrology machine designed to improve the accuracy and reliability of die-level testing. This tool provides a range of capabilities, from sophisticated analytics to powerful inspection capabilities, and is designed for high-speed and accuracy in a range of materials. This asset is an asset for any automated wafer testing and metrology application.
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