Used BRUKER-AXS Dektak XT #9204115 for sale

BRUKER-AXS Dektak XT is an advanced wafer testing and metrology equipment designed for a variety of applications. The system is capable of analyzing wafers from 2" to 8" for their thickness, smoothness, roughness, conductivity, dielectric breakdown, and other surface measurements. BRUKER-AXS DEKTAKXT utilizes an automated platform that offers a patented Constant Force Mode, which ensures consistent and repeatable measurements within 0.25% of the target force. The integrated vision unit inspects the wafer to ensure that it is level before and after analysis, ensuring accuracy of results. The machine can be configured with a variety of options, including an optical microscope, automated wafer handling, and wafer mapping capabilities. Dektak XT tool features an intuitive Graphical User Interface (GUI) for easy operation and automation. It also includes advanced data processing, graphics, and reporting capabilities on the PC. The PC-based software is easy to use and provides comprehensive analysis capabilities, including the analysis of bumps, particles, and coatings. In addition, DEKTAKXT offers a wide range of measurement capabilities with its ANOVA, FFT, 3D plot, and vibration compensation technology. ANOVA technology can be used to analyze wafer edge profiles, while FFT technology is used to analyze spectral data. 3D plot technology is used in the assessment of wafer shape, and vibration compensation technology allows for accurate measurements, even when the wafer is vibrating. The asset is ideal for a wide range of wafer testing and metrology applications, such as stress testing, defect analysis, and process control. BRUKER-AXS Dektak XT is also suitable for quality control and research and development use. In conclusion, BRUKER-AXS DEKTAKXT is an advanced wafer testing and metrology model that is designed for a variety of applications. The equipment utilizes innovative technologies and features a user-friendly GUI with a wide range of advanced measurement, analysis, and processing capabilities.