Used CAMECA Lexfab 300 #293637179 for sale

CAMECA Lexfab 300
ID: 293637179
Wafer Size: 12"
Vintage: 2012
Shallow probe metrology system. 12" Chamber (2) Loadports 2011 vintage.
CAMECA Lexfab 300 is a state-of-the-art wafer testing and metrology equipment, used for measuring the performance of integrated circuits and other thin-film layers in the semiconductor industry. It is designed to meet the exacting requirements of the 3-D semiconductor metrology market, enabling the highest accuracy and precision measurements. CAMECA LEXFAB300 is equipped with a high-precision optical metrology system employing a high-powered, laser-based autofocus, allowing for extremely accurate non-contact 3D measurements. This includes first-of-its-kind measurements of critical process parameters such as: profile, atomic force, key critical dimensions (CD), line-width, critical angle, tilt and residual stress. In addition, it can also evaluate the surface topography of thin-film layers in order to accurately measure the performance and reliability of the semiconductor device. LEXFAB-300 utilizes advanced optical technology and automated systems to achieve superior image quality and measurement accuracy. It includes a three-dimensional multi-beam scanning feature that provides flexibility to scan different portions of a wafer to measure even the smallest feature sizes. The unit is equipped with a high-resolution CCD image acquisition and processing machine, enabling measurements of sub-micron accuracy down to sub-millimeter scale. Lexfab 300 also offers a wide range of software options, including an extensive library of recipes and programs to simplify programming and reduce set-up time. It is designed with efficient automation and a user-friendly software interface, making the tool intuitive and easy to use. The asset also offers a range of predictive maintenance and quality control options, allowing users to evaluate process risks and prioritize product quality and reliability. LEXFAB300 is a sophisticated, state-of-the-art wafer testing and metrology model that provides high accuracy and precision measurements. Its advanced optical technology and features offer superior image quality, automated sample processing, and a range of predictive maintenance and quality control options to enhance the efficiency of wafer testing and device performance.
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