Used CDE 73B #293619550 for sale

CDE 73B is a wafer testing and metrology equipment designed by CDE Corporation, a leading provider of measurement solutions for the semiconductor and related industries. The system offers high-precision and repeatable measurements on individual wafers, enabling process control and qualitative defect analysis. It is equipped with advanced technologies such as 1D and 2D pattern recognition and inspection, automated image stitching, optical defect detection, and advanced auto-focus capabilities. 73B supports a variety of wafer materials, including silicon, glass, and organic materials. It can measure both non-imaging and imaging parameters such as die diameters, die pitch, dead wafer locations, and overlay accuracy. With its advanced image stitching feature, it can measure the entire wafer surface in a single pass and detect minor defects without the need for multiple measurements. The unit is also capable of performing complex, multi-dimensional measurements such as hill/valley, warp, and solder ball shape. Its ability to measure multiple patterns in 3D make it an ideal tool for process control and product quality analysis. In addition, the machine integrates with existing metrology tools for automated data collection and analysis. It's compatible with a wide range of imaging lenses, allowing users to select the best tool for their application. It also includes a powerful on-board pattern recognition library that supports a wide range of features and parameters, including 2D imaging, overlay, and multi-die inspection. CDE 73B is available in two configurable platforms, ranging in price from $150,000 to $350,000 depending on the number of measurement points, optics, and accessories. It is an ideal solution for semiconductor manufacturers, test labs, and production facilities looking for a reliable and accurate wafer metrology solution.