Used CDE RESMAP 178 #293639677 for sale

CDE RESMAP 178 is a state-of-the-art wafer testing and metrology equipment with a wide range of features, which make it ideal for applications in semiconductor wafer metrology and process monitoring. Its powerful imaging capabilities enable accurate measurement of wafer level characteristics and parameters with superior results. The system comprises of a 78 channel electron beam (EB) column with sub-nanometer resolution. This is coupled with a high-resolution, high-sensitivity, CCD camera that is capable of detecting even subtle changes in the surface of a semiconductor wafer. This makes it an effective tool for measuring various parameters such as etch depth, geometrical shapes, profile characteristics, patterning and doping features, etc. The unit also features a comprehensive set of metrology tools such as contour mapping, edge detection, asterism analysis, SEM imaging, and parametrization. These tools are designed to detect and measure even the smallest of surface features and help operators in identifying process trends. In addition to its advanced imaging capabilities, the machine also offers a range of user friendly controls and functions. These include manual and automated control of measurement parameters, support for a wide range of alignment systems, multiple coordinate systems, customizable display parameters, and automated data logging. Overall, CDE RESMAP178 wafer testing and metrology tool provides a powerful platform for wafer process monitoring and defect analysis. Its configurations to depth of focus, semi-automatic image comparison, and other features make it an ideal solution for semiconductor manufacturers looking to improve their wafer-level metrology capabilities.