Used CDE RESMAP 178 #293809836 for sale

CDE RESMAP 178 is a high-performance wafer testing and metrology equipment. It was designed for applications requiring extremely fast measurements of highly accurate critical dimensions and topography related parameters on various flat and contoured structures with multiple layers. The system uses profiling and diffuse reflectance technology to provide highly reliable metrology results. CDE RESMAP178 unit features a proprietary optical platform with improved resolution and accuracy. It uses a 4x reduction machine that ensures extremely precise measurements with excellent repeatability. The tool comes equipped with a powerful automated alignment asset (AAS) that reliably determines the sample's location and orientation, allowing the most intricate wafers to be tested even faster. Additionally, the model is equipped with a library of reference samples for easy validation and measurements of different types of materials and structures. The equipment can be calibrated for various types of measurements, such as x, y, z-axis, reflected laser intensity, and critical dimensions (CD). The system can also be customized with an integrated computer controlled Wafer-In-Place measurement unit (WIPMS), which allows complex wafers to be measured concurrently. The advanced optical configuration of RESMAP 178 machine is perfectly capable of accurately measuring nano features which are measured using high-quality focus and velocity correction systems. Additionally, the tool can measure critical aspect ratios and tolerances of ultra-precise features like trenches, steps and cavities. The asset also boasts an advanced user interface with a graphical user interface (GUI) for easy implementation of custom measurement specifications. Furthermore, it is also capable of controlling multiple systems simultaneously, allowing for a more productive way of testing wafers. In short, RESMAP178 wafer testing and metrology model is a comprehensive and versatile solution for fast, reliable and accurate testing of different types of materials and structures. The equipment's advanced optical platform, automated alignment system, library of reference samples and graphical user interface make it an ideal choice for all your wafer testing needs.