Used CDE RESMAP 178 #9366696 for sale

CDE RESMAP 178 is an advanced wafer testing and metrology equipment developed to meet the rigorous needs of the semiconductor industry. The system offers a variety of metrology tools, from a single integrated precision microscope to highly sophisticated laser profilometers, capable of measuring height, surface, and defect information over an entire wafer face. CDE RESMAP178 is designed to maximize throughput and capture even the most intricate details of wafer surfaces. The unit includes a wide variety of wafer testing, imaging and microscopy tools. The integrated custom-made Z-lens microscope is capable of capturing high-resolution images at x200 magnification of the entire wafer surface. The microscope is equipped with optical filters and lasers that offer a range of functionality, such as scanning across a variety of angles, measuring defect height and slope, and various autofocus capabilities. Additionally, the machine offers a custom-designed laser profilometer and chromatic confocal microscope. The laser profilometer, which is capable of zooming up to 800 times, enables the operator to measure, display and store wafer height, surface and defect information. The chromatic confocal microscope is capable of capturing three-dimensional images of defect sites and is also used to measure surface roughness. The tool is further equipped with a Metallurgical Fluid Scanner, capable of quickly and reliably identifying metal contamination and other defects. Additionally, the asset offers a variety of additional powerful microscopy tools, such as a Scanning Acoustic Microscope, Scanning Ion Microscope and Energy Dispersive Scans, enabling the user to measure and quantify a range of properties, such as topology and electrical properties. Overall, RESMAP 178 is an essential tool for wafer testing and metrology. In addition to offering a number of highly advanced features, the model is designed for high throughput, flexibility, and accuracy. The ability to deliver a comprehensive view of the wafer surface and other defect information, quickly and reliably, makes the equipment a valuable resource for semiconductor manufacturers.