Used CDE RESMAP 273 #293665012 for sale

CDE RESMAP 273 is an automated wafer testing and metrology equipment designed to quickly and accurately measure critical properties of semiconductor wafers. It is a high-precision, high-speed device, capable of taking numerous measurements on a single wafer in a matter of moments. The system is equipped with an advanced imaging unit that enables optimized viewing of wafers for measurements. This precision machine is designed with a modular architecture consisting of four primary components: the image capture and analysis board, the wafer handling board, the image pixel processor, and the data result processor. The image capture and analysis board uses illuminated laser light to analyze the surface of the wafer. The image is then transferred to the wafer handling board, which is responsible for the actual manipulation of the wafer. The image pixel processor then performs several different types of image analysis to measure critical features using automated algorithms. The data result processor receives the analysis from the image pixel processor and stores it in memory. The data can be further analyzed or transferred to external devices, allowing for further analysis or decision making. For added precision, the tool includes an optional position verification asset that can also take measurements of wafer size, shape, and location. In addition to its automated capabilities, RESMAP 273 also offers manual analysis capabilities. This includes a powerful interactive graphical user interface that makes it easier to identify and interpret the data from the wafer. It also has an extensive library of test recipes, making it easy to quickly set up tests for a variety of wafer characteristics. CDE RESMAP 273 is a powerful model designed to provide accurate and fast automated analysis of semiconductor wafer properties. It is an ideal choice for manufacturers looking for precision wafer testing and metrology capabilities. With its modular design and optional features, it can quickly and accurately measure critical wafer features for a variety of different types of wafer applications.