Used CDE RESMAP 273 #293760287 for sale

CDE RESMAP 273 is a wafer testing and metrology equipment designed to enable nondestructive testing of delicate semiconductor wafers. The system has a wide range of features that make it well-suited to wafer metrology, including an automated sensor unit, wide range of measurement capabilities, integrated vibration isolation, and a dual stage vacuum machine. The tool employs an automated wafer handling asset, providing precise movement of the sample across its sensor. This allows measurements to be taken quickly and accurately at any area on the wafer surface. In addition, the model includes capabilities to measure different parameters, including roughness, dents, scratches, pits, and step heights, as well as the ability to perform both automated and manual measurements. A major feature of the equipment is its integrated vibration isolation system. It utilizes both active and passive isolators to reduce the transmission of vibration into the unit during testing, thereby allowing more accurate results. Furthermore, it has a dual stage vacuum machine, which allows a portion of the wafer to be exposed to a lower pressure and provides additional isolation to minimize any potential interference. The tool also includes advanced software features. The software is user friendly and allows for easy operation, flexibility, and control during testing. Additionally, the software includes capabilities such as automated analysis, wafer mapping, and custom reporting. This makes the asset suitable for high level usage, and allows for more accurate and consistent testing. Finally, the model is designed for operation in a temperature controlled environment. This helps ensure accuracy, repeatability, and stability of data during testing. All these features make RESMAP 273 an ideal equipment for wafer testing and metrology.