Used CDE RESMAP 273 #293767239 for sale

CDE RESMAP 273 is a wafer testing and metrology equipment designed for high-throughput analysis of the physical and electrical properties of various patterned structures on wafers. It utilizes a high-resolution CCD based imaging system to map patterned features on circuitry with up to 10 micrometer accuracy, and can measure structures up to 3 mm in size. The unit uses advanced software to accurately analyze features on the wafer surface, and can measure such parameters as line widths, line ends, protrusions, and surface roughness. In terms of imaging, the machine is equipped with a set of lenses designed to provide high resolution imaging of wafers with up to 10x magnification. Additionally, the tool includes a high sensitivity lighting asset, providing a broad range of maximum intensity lights to generate high contrast images of any type of pattern. The imaging model includes a removable and replaceable wafer chuck, for versatile analysis of wafers. The equipment's data analysis capabilities are based on advanced software algorithms that allow precise measurement of electrical and physical properties on structures over large areas. These include algorithms for automated detection of structures, such as line ends and protrusions, and the accurate measurement of feature sizes. Additionally, the system can analyze resistivity and etch resistance data in order to determine optimal process parameters for wafer fabrication. The unit is also equipped with an automatic calibration machine that uses a laser interferometer for measuring the surface of the wafer. This allows for precise measurement of feature size, as well as accurate alignment of the imaging tool. The asset also includes a software interface for collecting performance data from process equipment. Overall, RESMAP 273 is an advanced model designed for high-throughput analysis of various structures on wafers. The equipment's advanced imaging and data analysis capabilities, as well as its automated calibration and performance monitoring capabilities, make it an excellent tool for wafer fabrication.