Used CDE RESMAP 463 #293777883 for sale

CDE RESMAP 463 is a wafer testing and metrology equipment designed for semiconductor applications. It is capable of surface mapping, defect mapping, 2D and 3D metrology, wafer inspection and metrology, and optical surface metrology. The system offers a variety of options for process control, such as real‐time scanning, runtime surface mapping, and combined surface mapping and process control. The unit is a combination of hardware and software that enables the mapping, inspection, and metrology of integrated circuits on wafer level. The software includes several modules that provide process control, such as real‐time surface mapping and process control. The hardware includes a unique software‐based robotic arm that can be programmed to move along the surface of the wafer to accurately perform inspections, surface mapping, and metrology. The machine includes two high‐resolution cameras, each featuring a 5 megapixel resolution, allowing for a maximum image resolution of 2 microns per pixel. The tool is compatible with a variety of pattern recognition algorithms and image analysis techniques, such as Hough Transformation, Wavelet Decomposition, and Generalized Hough Transformation. These techniques enable the asset to identify and analyze the defects in integrated circuits, as well as their distribution. RESMAP 463 model is designed to be modular, with optional modules for additional performance or functionality, such as a beam scanner for defect scanning and a thermal imaging equipment for simultaneous bottom‐side imaging. Additionally, the system is equipped with an automatic defect classification unit, which can automatically classify and segregate various types of defects, including scratches, cracks, and delamination. CDE RESMAP 463 machine is capable of generating high‐level analysis data that can be used to assess the efficiency of process control, as well as the performance of the tool and the products that are being tested. The asset is capable of performing data analysis on a variety of metrics, such as reliability and yield. Additionally, the model is capable of supporting non‐linear regression, which can provide an improved accuracy for predicting the yield of a given process. All in all, RESMAP 463 is a highly advanced wafer testing and metrology equipment, offering excellent flexibility and performance. Featuring advanced pattern recognition algorithms and image analysis techniques, the system is capable of accurately detecting and classifying defects in integrated circuits, as well as efficiently performing process control. Additionally, the unit is capable of providing detailed data analysis, providing valuable information for improving process control and yield.