Used CDE RESMAP #293814714 for sale

CDE RESMAP is an advanced wafer testing and metrology equipment that provides a fully automated and integrated solution for the characterization of thin films, conductors and dielectrics, along with 3-D topography and critical dimension measurement of microelectronic devices. The system includes a universal wafer testing unit, deep reactive-ion etching (DRIE) technology, and both reverse engineering and defect analysis capabilities. The wafer testing machine provides for the physical probing and testing of thin film devices, providing a wide range of tests such as electrical resistance, capacitance and inductance, along with probing and traceability. The DRIE technology is used to create high-aspect-ratio trench and feature profiles, which are then analyzed for the critical dimension and topographical properties. Additionally, 2-D material analysis utilizing optical, SEM, EDX and Nanomechanical AFM capabilities are available. The reverse engineering capabilities of the tool allow existing designs to be reverse-engineered and immediately tested, eliminating the need for re-design. The defect analysis capabilities include dielectric and leakage testing, which can be used to quickly detect faults and errors. In combination, these capabilities allow for the comprehensive testing of wafers quickly and efficiently, providing a powerful tool in the process technology and product development of microelectronic devices. Additionally, automated data collection and analysis can be used to provide a more comprehensive understanding of the device parameters, enabling repeatable results and improved process understanding. RESMAP offers a complete solution for testing and metrology, providing an invaluable tool for the development and analysis of advanced microelectronic devices.