Used DNS / DAINIPPON VM-8200 #9374928 for sale

DNS / DAINIPPON VM-8200
ID: 9374928
Thickness measurement systems.
DNS / DAINIPPON VM-8200 is a wafer testing and metrology equipment designed for commercial IC and MEMS fabrications. This system features a wide range of metrology and testing capabilities, such as non-contact measurement, nanometer-scale imaging, multi-dimensional electrical testing, and optical inspection. DNS VM-8200 includes enhanced optical capabilities featuring near-infrared, multi-wavelength and polarization imaging. These imaging capabilities enable DAINIPPON VM 8200 to capture the widest range of textures, morphology, and optical features on a variety of wafer surfaces with high accuracy. In addition, the unit incorporates expansive electrical test capabilities, allowing for testing of both large and small circuits and including multiple current and voltage measurement methods. These electrical testing capabilities are combined with 3D voltage mapping and current density mapping for a variety of applications. VM 8200 also features non-contact overlay measurement, enabling highly precise pattern alignment and overlay placement verification. The machine can measure overlay variations as small as 8nm and provides a 3D image of the wafer surface for comparative analysis. Furthermore, VM-8200's nanometer-scale imaging ability enables users to capture detailed SEM images from under 3nm up to 50µm in both cross-section and top-down views. To ensure maximum accuracy and repeatability in testing, DAINIPPON VM-8200 includes special algorithms and processes for data acquisition, processing, and analysis. Additionally, the tool provides a set of automated wafer identification functions that can help identify and differentiate between wafers within a frame. This wafer identification methodology assists users in faster and more accurate measurements without manual input. Overall, DNS / DAINIPPON VM 8200 is an all-in-one testing and metrology asset for commercial IC and MEMS fabrications. It allows for high-accuracy 2D and 3D imaging, electrical testing, and non-contact overlay measurement. Furthermore, automated wafer identification functions and process optimization algorithms provide users with reliable and accurate results.
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