Used E+H METROLOGY MX 204-8-37-Q #9234106 for sale

The E+H METROLOGY E+H METROLOGY MX 204-8-37-Q is a wafer testing and metrology equipment designed for high end wafer production and inspection. It has an advanced software algorithm that can detect a wide range of defects and discrepancies in the wafer surface, including pits, scratches, and other surface irregularities. The system can also detect bad imaging of critical points on the wafer. The E+H METROLOGY MX 204-8-37-Q features a dual-side scan unit head that allows for independent scanning of both sides of a wafer. It also has a high powered laser that offers a high-resolution surface measurement accuracy of 0.0001 microns. Each feature allows for an accurate application of finite capability analysis, gauge variable measurement, process capability analysis, and process control across a wide range of applications. The E+H METROLOGY E+H METROLOGY MX 204-8-37-Q also comes with a variety of advanced features that make it a dynamic and capable machine. This includes a powerful analysis software that allows for advanced analysis and statistical evaluation of surface metrology data. It also has a repair tool for rectifying images with defects caused by metallic or other impurities, dirt, or particles on the wafer surface. Additionally, it comes with a production control software which allows for tracking and controlling the production process and allows the user to identify and minimize any defects. Furthermore, the E+H METROLOGY MX 204-8-37-Q can facilitate both manual and automated wafer handling, allowing for optimal flexibility. It comes with a work-coordinated device, like a robot, for wafer positioning and loading. It also has a temperature monitoring tool and a 3D translation stage to provide an accurate and efficient inspection and measurement. The E+H METROLOGY E+H METROLOGY MX 204-8-37-Q offers superior wafer inspection and metrology capabilities, allowing for the highest level of wafer production and inspection. Utilizing its advanced software algorithm, dual-side scan asset head, powerful laser beam, production control software, manual/automated wafer handling capabilities, temperature monitoring model, and 3D translation stage, the equipment is capable of detecting and rectifying defects and discrepancies on the wafer surface with accuracy and beyond that of traditional inspection methods.