Used E+H METROLOGY MX 204-8-37-Q #9234111 for sale
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ID: 9234111
Vintage: 2007
Wafer measurement system
Square / Pseudo-square: 125-156 mm
Gauge type: MX 204-8-25-q
Thickness range: 200 - 600 μm
Real: 180 - 600 μm
CE Marked
2007 vintage.
The E+H METROLOGY E+H METROLOGY MX 204-8-37-Q is a wafer testing and metrology equipment designed to provide high speed and accuracy measurement data. This system offers advanced lithography capabilities that allow for precise etch depths and dimensions to be measured, in a rapid and automated method. The complete unit consists of an MX204 Configurable Wafer Characterization Machine (CWC), an integrated test bed, several automation technologies and a wide range of accessories and connectors that compose a complete metrology package. In general, the tool operates at high-speeds and is capable of sample measurement in less than 12 seconds. It comes equipped with a high resolution optical microscope that provides a maximum field of view of 1.5um and a resolution of 0.5um, as well as an integrated wafer handling asset that allows for samples to be analyzed even at a temperature of up to 40 degrees C. The optical microscope is capable of precisely measuring wafer flatness, thickness and defect size in order to monitor process parameters. Additionally, it can image samples in real time and provide real time display of up to 20 images. Moreover, the automation technologies included in the model are capable of providing a fully automatic inspection process that includes defect and etch depth/dimension measurement. Additionally, the equipment also integrates a programmable logic controller (PLC) for adapting to rapid environment changes and a serial link for controlling peripheral equipment. The system also features a support for a variety of test and metrology recipes, including automotive and optical requirements. Additionally, the unit is highly configurable to meet the demands of various users. It includes the E+H MAGSYS METROLOGY software, a powerful platform for efficient metrology and defect classification, as well as a Probing Machine for testing samples at high speeds. This machine is also compatible with an extensive range of third-party measuring systems, including Teradyne and KLA. Finally, the tool can be connected to a computer via a serial link and an Ethernet connection. The asset also comes with a variety of accessories, such as a Wafer Edge Detection Platform and an Inspection Platform. Additionally, a setup and service package is also available with the model in order to facilitate quick installation and start-up, as well as calibration and maintenance.
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