Used FILMETRICS F10 #293626260 for sale

FILMETRICS F10 Wafer Testing and Metrology Equipment provides comprehensive data on pre-CMP, post-CMP, and post-etch structures, yielding superior process control and transformation.The system uses single wavelength spectroscopic ellipsometry to simultaneously measure film thickness, refractive index and optical constants of films on wafers. Both thicknesses and optical constants for dielectric films down to 0.3nm are measurable; for metallic films, thicknesses down to 1nm can be measured. The unit is highly accurate and repeatable, with an analysis repeatability of less than 2%, and a thickness repeatability of 0.5nm. FILMETRICS F 10 utilises a non-contact monitoring mode, allowing for non-destructive feedback from the surface of the material being tested. F10 also offers real-time feedback, allowing for measurements to be registered and automatically reported in situ, reducing time-consuming laboratory measurements. Its wide measurement range enables F 10 to measure a range of films made from dielectrics, oxides, nitrides, metal oxides, metal nitrides and metals, with various thicknesses and compositions. The machine can accommodate substrates up to 150mm in diameter, at varying angles of incidence. Molecules and molecules to scan charge surfaces can be followed and tracked over time, enabling advanced process monitoring and process adjustment. Additionally, FILMETRICS F10 is particularly well-suited for rough surfaces such as those found on CMP layers, due to its superior signal-to-noise ratio. FILMETRICS F 10 offers a user friendly, intuitive GUI that enables users to quickly set up and begin running measurements. A variety of output formats can be provided to further simplify the analysis process. Also, the tool comes with 21C and ISO 17025/17034 Certifications, making it compliant for use in regulated industries. In summary, F10 Wafer Testing and Metrology Asset is capable of detailed measurement and analysis of wafers and film structures, yielding superior process control and transformation. Its accuracy, repeatability, and non-contact monitoring capabilities, along with its wide range of relevant certifications, makes it the perfect tool for all aspects of wafer and film measurement and control.