Used FILMETRICS F20-UV #293592882 for sale

FILMETRICS F20-UV Wafer Testing and Metrology Equipment features a unique combination of optical imaging, metrology, and wafer-level characterization capabilities. This system is designed for high-throughput, automated testing and metrology of thin films on semiconductor wafers for device characterization or process development. It is capable of measuring sub-micron, micron, and nanometer thickness variations of thin films on semiconductor wafers in a variety of formats, as well as with arbitrary pattern sizes, shapes, and opaque masks. FILMETRICS F 20 UV includes a wavelength-tunable laser unit configured with a proprietary, non-interferometric spectral reflectometer and imaging machine, which enables rapid measurement of the thickness of opaque film structures. This reflectometer and imaging tool operates across the visible and ultraviolet spectrum, offering a flexible solution suitable for various procedures. In addition, the asset uses high-power, high-resolution imaging technology to detect low sampling frequencies and yield defect information. The model also includes a computer software package, which is an easy-to-use interface ideal for analyzing wafer data quickly and efficiently. This software package is designed to offer intuitive graphical representation of the data, enabling users to monitor, compare, and highlight features of interest. The software also features 2D and 3D graphing capability, providing advanced data analysis and visualization. In terms of performance, F20-UV delivers high resolution, fast measurement rates, and repeatability of film thickness and roughness on a variety of wafer types. Its accuracy and ease of use make it an ideal choice for device characterization and process development. The equipment is also suitable for harsh environment operation, making it suitable for a wide range of applications. Overall, F 20 UV Wafer Testing and Metrology System is an advanced and reliable unit designed to facilitate high-throughput, automated testing and metrology of thin films on semiconductor wafers. With its combination of wavelength-tunable laser machine, imaging technology, and user-friendly software, this tool provides a comprehensive solution to facilitate accurate and repeatable measurements of film thickness and roughness on wafers.