Used FOGALE NANOTECH Deeprobe 300-M #293644160 for sale
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ID: 293644160
Wafer Size: 8"
Vintage: 2014
System, 8"
CCD Camera
Adjustable metrology spot size
TSV Diameter: >2 µm A:R Up to 30
2014 vintage.
FOGALE NANOTECH Deeprobe 300-M is an automated wafer testing and metrology equipment designed for advanced semiconductor metrology. It is a multi-dimensional semiconductor metrology system that is capable of performing wafer mapping for electrical and physical properties. Deeprobe 300-M has been designed with the most advanced silicon wafer technologies in mind. It is equipped with an automated prober and a high-precision imaging unit for accurate metrology. FOGALE NANOTECH Deeprobe 300-M utilizes an innovative "stacked-sensing" technique to measure diameter, line width and other parameters across a wide range of samples over micrometer scale. The prober is configurable to accommodate various probe tip sizes, which can measure with exceptional accuracy and repeatability over the full sample range. This machine is also one of the few metrology systems that can automatically calibrate for profile errors to ensure accurate results. Deeprobe 300-M features a powerful imaging tool that allows it to accurately detect any defects in the silicon wafer. This includes grain boundaries, particle and voids, lateral grain size, and more. The imaging asset also allows the model to produce a depth map of the sample profile, which helps in identifying profile variations or other defects. The user-friendly software interface is designed to make operation of FOGALE NANOTECH Deeprobe 300-M simple and intuitive. The equipment can easily be integrated with other tools or techniques used for wafer analysis through standard industrial protocols. This allows for simplified set up and use, which helps improve the efficiency of wafer manufacturing processes. To ensure the accuracy and repeatability of results, Deeprobe 300-M also features a comprehensive analytics and reporting system. This information can be used to refine process controls and improve wafer yield. The unit can producers dynamic reports that provide data on metrics such as defect profile shape, edge angle, grain size distribution and more. In summary, FOGALE NANOTECH Deeprobe 300-M is an automated wafer testing and metrology machine that provides exceptional accuracy and repeatability in wafer mapping for electrical and physical properties. It features powerful imaging and analytics capabilities to ensure accurate results, and its user-friendly software interface makes it easy to operate. The tool has been designed for use in advanced semiconductor metrology applications and is ideal for wafer inspection, defect monitoring and process improvement.
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