Used FSI / TEL / TOKYO ELECTRON Zeta 300 #9160258 for sale

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ID: 9160258
Wafer Size: 12"
Vintage: 2004
Spray cleaning system, 12" Process: PR Stripper: High temp H2SO4 process (220°C) 2004 vintage.
FSI / TEL / TOKYO ELECTRON Zeta 300 is a high-performing photoresist equipment that is used in the semiconductor industry to process microfabricated components. FSI Zeta 300 utilizes a high resolution projection alignment system to accurately align the microfabricated components. TEL Zeta 300 utilizes an automated contact-type aligner, which can provide nanometer-scale alignment accuracy and ensure uniform exposure of the photoresist material. Zeta 300 is also equipped with a resolution monitor that can accurately monitor the development of the components during the process. TOKYO ELECTRON Zeta 300 also offers a variety of substrate pre-treatment and post-treatment solutions. This includes an automated wet processing station, automated measurement unit and specialized material processing capabilities. Additionally, FSI / TEL / TOKYO ELECTRON Zeta 300 is equipped with a programmable intelligent loader/unloader that can move wafers between the different stages of the process. FSI Zeta 300 utilizes two source-plate electron-beam exposure systems to accurately expose the photoresist material to the required ultraviolet (UV) radiation. These systems can process up to two substrates at once, are capable of delivering up to 7,500 mJ/cm2 per exposure cycle, and can be programmed to deliver uniform dose per field. The electron beam systems are capable of resolving features down to 0.5 μm in size and can expose materials such as photoresists, dielectrics, or metals. TEL Zeta 300 also features an Automatic thickness monitor (ATM) which is capable of automatically measurement of the thickness of the photoresist material. The ATM is capable of monitoring up to 20 regions on the substrate simultaneously, allowing for accurate measurements and control of the development process. Zeta 300 is also equipped with a specialized Atmospheric Pressure Plasma CVA (APPC) machine, which is able to produce high energy oxygen plasma for reliable ai the hotplate or wafer backgrinding, thereby reducing the chances of wafer breakage. The APPC tool is also capable of producing a variety of other gases for specific post-process applications. Finally, TOKYO ELECTRON Zeta 300 is also equipped with a hotplate asset, which is used to uniformly distribute the photoresist material on the substrate. The hotplate can also be used to perform soft-bake operations. FSI / TEL / TOKYO ELECTRON Zeta 300 is easy to use and can be managed by a single user, making it ideal for a low-volume production environment.
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